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MicroTech 2026 – Driving Innovation in Semiconductor Packaging

MicroTech 2026 will be an In Person Event on Thursday 26th March 2026 at King’s Conference Centre, Upper Northam Road, Hedge End, Southampton, SO30 4BZ.

MicroTech 2026 is the Annual IMAPS-UK Conference which will focus on Driving Innovation in Semiconductor Packaging. This In Person Conference combines invited Keynotes and presentations from leading Industrial Companies and Research Organisations. The Conference will also include the IMAPS-UK Annual General Meeting (AGM).

MicroTech 2026 will provide examples of microelectronics packaging solutions that will not only be expected to demonstrate enhanced performance and optimised costs, but also improved reliability, reduced thermal impact, overall life cycle cost benefits and a robust supply chain.

Provisional MicroTech 2026 Conference Agenda – subject to amendment

TimeTitle
08:30Registration, Exhibition and Networking
09:30Welcome and Introduction to IMAPS-UKEamonn Redmond, MicroTech 2026 Conference Chair
09:40Session 1: Semiconductor Packaging - Market and UK Strategy
09:40Keynote: UK Semiconductor Centre and How to Become InvolvedUK Semiconductor Centre
10:10Advanced Packaging Technology and Manufacturing TrendsYole Group
10:40Sponsor WelcomeInseto (UK) Ltd
10:45Exhibitor Introductions
11:00Refreshments: Exhibition, Posters and Networking
11:30Session 2: Advanced Packaging Techniques
11:30Laser Solder Jetting and Laser Assisted Bonding and ReflowPactech
11:55Fluxless Die-to-Wafer TCB: A Reliable and Contamination Free Approach to 3D Integration
BESI

12:20IMAPS-UK AGM
13:00Lunch: Exhibition, Posters and Networking
14:00Session 3: Heterogeneous Integration and Interposers
14:00Keynote: CHIMES Making UK Electronic System Design Globally CompetitiveUniversity of Southampton

14:30The Development of a UK based Supply Chain for Silicon and Glass based Interposers for Advanced Packaging ApplicationsBAE Systems
14:50A Customisable Interposer based Packaging Platform for Heterogeneous IntegrationHybrid Integration Ltd
15:10Refreshments: Exhibition, Posters and Networking
15:30Session 4: Applications, Reliability and Failure Analysis
15:30Top-Side Cooling Integration for Power MOSFET Packaging for Automotive and High-Performance ApplicationsNexperia
15:50Novel Technique for Scanning a 4 x 5mm Semiconductor Chip comprising 12 x 12 QLE Matrices and Mapping the Sub-micron XY co-ordinates of the QLEs and their Mode CentresBay Photonics
16:10Physics Informed AI for Early Prediction of Solder Joint Degradation in Aerospace and Automotive Power ElectronicsBuckinghamshire New University
16:30Advanced Failure Analysis Techniques for Complex Electronic PackagingNanoscope Services
16:50Closing Remarks and Poster AwardsEamonn Redmond
17:00Depart

Attendance at MicroTech 2026

Registration for MicroTech 2026 is open below.

  • IMAPS-UK (and IMAPS Worldwide) Member: £85 – Book Ticket MT26-01
  • Non Member: £155 Book Ticket MT26-02
  • Students and Poster Doctoral Researchers (PDRs): £30 – Book Ticket MT26-03
  • Students, PDRs and Early Career Professionals with Approved Abstract Submission: £0 (free) Book Ticket MT26-03P

Heterogeneous Integration – Explained! Workshop – Wednesday 25 March 2026 – Fully Booked

IMAPS-UK and the CHIMES IKC are running an Heterogeneous Integration – Explained! Workshop at the University of Southampton on the afternoon of Wednesday 25 March 2026

This workshop will focus on the fundamental aspects of Heterogeneous Integration, explaining the design and assembly requirements, and exploring the opportunities for advanced packaging manufacturing solutions in microelectronics, power electronics and photonics. This workshop will be complemented with a tour of the facilities at the Southampton Nanofabrication Centre.

Registration for the Heterogeneous Integration – Explained! Workshop is now closed, as the capacity of the venue has been reached.

Please e-mail the IMAPS-UK Office to be placed on a reserve list, in case of cancellations.

Travel Fund for PhD and Undergraduate Students – Open for Application

The MicroTech 2026 organising team is pleased to announce that some funds are available to support economy rail travel and public transport costs for UK-based PhD and Undergraduate students attending the MicroTech 2026 Conference, subject to an eligible case being submitted by PhD and Undergraduate Supervisors. The Supervisor will need to e-mail the IMAPS-UK Office to confirm that their student does not have access to institutional funds to cover travel costs. Applications will be responded to as soon as possible.

Networking Dinner on Wednesday 25 March 2026 at the Hilton Southampton – Utilita Bowl

Booking for the Evening Meal is now closed, as final numbers had to be confirmed with the venue.

MicroTech 2026 Sponsors

Click on Company Name or Logo for Weblink

Inseto (UK) Ltd

Inseto is a premier technical distributor of equipment and related materials to the semiconductor, microelectronic and advanced technology sectors. We also cater to the electronics, automotive and industrial manufacturing industries with our range of adhesives.

Our advanced equipment and materials are organised into specialist technology divisions, each offering meticulously selected, technically innovative, high-performance products.

The “Equipment Division” at Inseto provides a comprehensive range of precision equipment for device fabrication, assembly, testing and quality assurance. We offer full technical support including process, operation and maintenance assistance, as well as training to maximise equipment performance and enhance the quality of results.

Our “Consumables Division” supplies high-quality materials, subcontract services and tooling essential for developing and manufacturing the latest generation components and devices. Our specialist engineers are available to help you select the right material or machine consumable to meet your specific requirements or processes.

Representing DELO Industrial Adhesives exclusively, our “Adhesives Division” possesses the technical expertise to advise on all your bonding, sealing and encapsulation needs, including both conductive and non-conductive die attach and glob-top materials.

With a long-standing history, Inseto’s “Wafer Division” supplies wafers for semiconductor, micro and nanotechnology applications. We provide products requiring exceptionally flat and smooth hydrophobic surfaces. Our extensive range of high-quality wafers-substrates is used globally by universities, research facilities, semiconductor and original equipment manufacturers.

For more information, please visit our website: www.inseto.co.uk

MicroTech 2026 Exhibitors

  • Accelonix – Specialist equipment sales and support for Microelectronics, Battery and PCB Assembly
  • Carl ZEISS – Imaging Solutions for the Semiconductor and Electronics market
  • Custom Interconnect Ltd (CIL) – Electronics Manufacturing, Advanced Technologies, Design Services, Power Electronics for BEVs/PHEVs, Box Build and Rapid Prototypes
  • DISCO HI-TEC Europe – Semiconductor Dicing and Grinding solutions
  • Eurofins|Maser – Independent service provider for Failure Analysis and Reliability Test
  • Gen3 – Specialist British Manufacturer and Distributor of Test and Measurement Equipment
  • INPACK – Advanced IC Packaging, SiP PCB and Oraganic Substrates
  • IPP Group Ltd/Cupio Services – Innovative Inspection, Production and Test Solutions
  • KLA Corp (SPTS Division) – Advanced Wafer Processing Solutions
  • MCS – Applies forensic science to support the design. manufacture, qualification and failure analysis of all kinds of semiconductor. electronic and electro-mechanical systems
  • SiTEST Ltd – Supporting the Semiconductor, Micro-Electronic, Test and Web Inspection Industries
  • Techworks – TechWorks is the UK deep tech industry trade association supporting the UK microelectronics industry across the technology spectrum from chip design, manufacturing and packaging to electronic, photonic and software systems and to applications in automotive, power, IoT, cyber security and AI.

Exhibit at MicroTech 2026

All Exhibition Places are now taken

Venue, Travel Information and Accommodation Options

Full Address

King’s Conference Centre, Upper Northam Rd, Hedge End, Southampton SO30 4BZ

Please click on the link to What3Words///tour.zealous.bells

Please click on the link to the King’s Conference Centre Website

Travel Information

The King’s Conference Centre is located close to Junction 7 of the M27. Free car parking for attendees is available on site.

Public Transport

The nearest railway station is Hedge End which can be reached from London Waterloo in about 1hr 30minutes with hourly direct trains.
Hedge End train station is 1.7miles from the Conference Centre.

Taxis would need to be ordered by Uber or other Apps, as there is no Taxi Rank at Hedge End Station.

Local Accommodation

Accommodation costs are not included in the MicroTech 2026 Ticket.

The following hotels are located near to the King’s Conference Centre (Click on Hotel Name):

Cancellation Policy

Please click on Cancellation Policy for information on cancellations and changes to event format for bookings.

For further information, please contact:

IMAPS-UK Secretariat
Telephone: + 44 (0) 7804 980 954
Email: office@imaps.org.uk

Book Event Tickets

When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .

Bookings are now closed for this event. - Please contact the IMAPS-UK office for further details

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Date/Time
Date(s) - 26/03/2026
8:00 am - 5:00 pm

Location
King's Conference Centre
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