Next Generation Sintering Solutions Webinar: Thursday 10 September 2026- 10:00 – 11:00 UK time
A Webinar on Inventec’s ECOREL™ SINTEC product range
As power electronics continue to evolve (SiC, GaN), interconnection technologies are facing increasing thermal, mechanical and reliability constraints. However, conventional soldering approaches can become limiting in terms of thermal performance and long-term reliability in high-power applications.
Sintering is progressively being evaluated as an alternative, particularly where high thermal conductivity and robust interconnections are required.
This INSETO UK Ltd IMAPS-UK Corporate Member webinar will provide a technical overview of sintering technologies, along with a presentation of Inventec’s ECOREL™ SINTEC product range and their positioning across different process approaches.
Webinar Agenda – Thursday 10 September 2026 from 10:00 – 11:00 (UK time)
- Context: evolution of power electronics and assembly challenges
- Soldering vs sintering: fundamental differences
- Overview of sintering mechanisms and materials
- Pressure, low-pressure and pressureless processes
- Introduction to ECOREL™ SINTEC range
- Process considerations and typical limitations
- Q&A
Topics covered
- Soldering vs sintering: process and performance considerations
- Overview of sintering process routes and associated constraints
- Positioning of ECOREL™ SINTEC across different applications
- Typical challenges: porosity, delamination, surface finish sensitivity
- Key elements for industrial implementation
Presenters
Anne-Marie Laügt – Sintering Expert – Inventec Performance Chemicals
Eamonn Redmond – Senior Sales Engineer– INSETO
Download the ECOREL TM SINTEC – Next Generation Sintering Solutions Flyer.
Who Should Attend?
- Engineers and Technicians involved in Microelectronics Design, Manufacture and Test
- Undergraduates, Post-graduates and Early Career Professionals interested in Electronics Research, Development and Productions
- Quality Engineers, Supply Chain Personnel and Managers wanting to gain an appreciation of sintering methods used in microelectronics assembly
Registration
Registration for the Sintering Solutions Webinar is free and open below.
Once registered, Joining Instructions for the Webinar will be sent 1 week before the event
Consent:
I confirm that my name and institution/organisation can be included in the attendee list for the webinar.
Please e-mail the IMAPS-UK Office if you have an objection to the above consent.
For further information, please contact:
IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004
Email: office@imaps.org.uk
Book Event Tickets
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
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Date/Time
Date(s) - 10/09/2026
10:00 am - 11:00 am
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