NordPac – The Nordic Conference on Microelectronic Packaging – 12-14 June 2022

Will be held on-site at Chalmers University of Technology, Gothenburg, Sweden. The NordPac conference is a strong platform that brings together academics, as well as industry leaders, to discuss and debate state-of-the-art and future trends in microelectronics components, packaging, integration, and manufacturing technologies at the Nordic, European and international scale. NordPac provides a perfect opportunity to hear the latest news and developments in the field.

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