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Optoelectronic packaging is one of the current main challenges for optoelectronic device and optoelectronic integration. Among others, it comprises optical underfill compound, optical fiber array, micro lens, silicon carrier and substrate effects on the thermal, optical and reliability performance of optoelectronic packaging. To overcome these challenges, a wide range of analysis and expertise for integrated optoelectronics, thermal and power management should be done.
Traditionally, each optoelectronic technology has followed their own packaging roadmaps, technologies, design rules and standards (eg. PIC (Photonic IC), VCSELs, MEMS based sensors, LEDs, etc.). This workshop will explore common challenges between different photonic technologies as well as bring together the entire value chain in order to identify the current bottlenecks and the ways to circumvent them.
Don’t miss this opportunity to hear from and network with experts, share thinking with peers and meet our Exhibitors from the Packaging Supply Chain at the co-located exhibition.
This unique Conference, is jointly organised by:
IMAPS (International Microelectronics, Assembly and Packaging Society, UK Chapter)
JEMI UK (Joint Equipment Materials Initiative)
EPIC (European Photonics Industry Consortium)
SEMI (Semiconductor Equipment and Materials International).
Session One: Setting the scene – User perspectives
Session Two: Packaging design and software
Session Three: Packaging services, equipment and testing
Session Four: Integrators and user cases
12:00 Registration, Exhibition & Networking
13:00 Welcome, Introductions: Duncan Hand (Heriot Watt)
13:30 Session One: Setting the scene – User perspectives
- KEYNOTE 1: Peter O’Brien, Head of Photonics Packaging Research, Tyndall National Institute.
- Nicola Pavarelli, Senior Process Engineer (Photonics Packaging), Huawei Technologies – “Optoelectronic Assembly Challenges from the Telecommunications Industry”
- Ewit Roos, Managing Director, Photon Delta
15:00 Break: Coffee, Tea & Refreshments, Exhibition & Networking
15:30 Session Two: Packaging design and software
Niek Nijenhuis, Global Sales Marketing Manager, PhoeniX
Bedwyr Humphreys, Chief Development Officer, Seren Photonics
16:30 Break: Coffee, Tea & Refreshments, Exhibition & Networking
17:15 Session Three: Packaging services, equipment and testing -I
Martin Van Acht, Director, Tegema
Antonello Vannucci, Chief Technology Officer, Linkra – “Photonic Integrated Package Design”
Andrew Thompson, Technical Sales Manager, Optocap
18:30 Reception & Buffet
09:00 Session Four: Packaging services, equipment and testing -II
Keynote 2: Eric Mounier, Senior Analyst MEMS Devices & Technologies, Yole Developpement – “Silicon Photonics Markets Outlook” Ignazio Piacentini, Director Business Development, Ficontec
Guénaël Ribette, General Manager, Microtest
Douwe Geuzebroek, VP Marketing & Sales, LioniX International
10:50 Break: Coffee, Tea & Refreshments, Exhibition & Networking
11:30 Session Five: Integrators and user cases I
Timo Aalto, Research Team Leader, Silicon Photonics, VTT –
Antonio La Porta, Research Staff Member, IBM – “Scalable Optical Coupling between Polymer Waveguides and a Silicon Photonics Chip”
Michael Robertson, VP Research Programmes, Huawei-CIP – “Low Cost packaging solutions in Photonic Integrated Circuits with large port counts”
Kaiam – “Embracing Diversity:Hybrid Integration for Data Centre Optics”
12:50 Lunch, Exhibition & Networking
14:20 Session Six: Integrators and user cases II
Pim Kat, President, Technobis Group – “From a Naked Die to a Working System”
Ana Gonzalez, Dissemination Manager, MIRPHAB – “MIRPHAB: A Pilot Line for Mid-Infrared Sensors and Spectrometers”
Dmitrij Siskin, Development Engineer, Oxsensis – “Design Requirements for Opto-Electronic Sensing Systems in Harsh Environments”
15:20 Closing Remarks
15:30 Tour of Heriot Watt –
School of Engineering and Physical Sciences Laboratories (CIM-Laser)
Who Should Attend:
End-Users, Manufacturers, Production & Manufacturing Engineers, Researchers & Developers, Scientists, Supply Chain Companies, Process Engineers, Product Designers & Students etc.
The event is open to all including non members, the following delegate rates apply:
Member (IMAPS-UK, JEMI-UK, SEMI or EPIC): £185
Non Member: £225
All prices plus VAT and inclusive of free parking, lunch & refreshments.
Interested in Exhibiting:
Is your Company interested promoting itself to delegates who are attending to learn about the latest in Photonics & Opto-Electronics Packaging? Then reserve your tabletop without delay! Exhibits are available on a first-come, first served basis (no more than two per Company). Exhibitors are also offered the opportunity to provide a two minute presentation introducing their Company to the delegates at the opening of the Conference, plus receive a complimentary website and full programme listing.
Don’t Miss Out On Your Opportunity to Exhibit at the Photonics & Opto-Electronics Packaging Conference!
Member Tabletop Exhibit: £480
Non-member Tabletop Exhibit: £580
All prices plus VAT and inclusive of one delegate place, free parking, lunch & refreshments.
Interested in sponsoring this event? Available sponsorship opportunities are listed below:
Main Event Sponsor
Refreshments, Lunch & Programme Sponsors
Please contact us if you are interested in sponsoring the event.
For quotes, please contact the respective account managers
Marriott – www.marriott.com
Amanda Vettese, Account Manager Scotland/North, 0131 335 8076 , 07552275134, Amanda.email@example.com
Novotel & IBIS Budget – www.accorhotels.com
Therese Yvert, Reservation Team Leader, 0131 446 5640, H6515-RE@accor.com
Holiday Inn – www.hiedinburghhotel.co.uk
These three hotels are 5-10 minutes from the venue by car. There is also a public transport bus connecting the Novotel, Marriot and Ibis Budget (bus number 63). The timetable can be found at www.lothianbuses.com
For further information, please contact:
Telephone: + 44 (0)131 202 9004
Registration Website: Coming Soon!
Book Event Tickets
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
Bookings are now closed for this event. - Please contact the IMAPS-UK office for further details
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Payment for tickets to IMAPS-UK events is completed via the Stripe gateway
Date(s) - 22/11/2016 - 23/11/2016
12:00 pm - 3:30 pm