Date(s) - 23/10/2018
8:00 am - 5:00 pm
IMAPS UK, in partnership with the Torbay Hi-Tech Forum, bring you the 2nd International Conference on Packaging Technology for the Photonics and the Opto components and systems industry.
The conference will meet the needs of those involved with the design of systems, development of components as well as users and will address issues of placement of die and components, Die and component Packaging for emerging
Optoelectronic technology applications. Interconnection technologies will be a key feature of the presentations and the event will offer the opportunity to learn about emerging Photonics and Opto Technology, Process tools and flows, Materials and equipment selection/options as well as the Design – Industrialisation aspects that are now required.
Don’t miss this opportunity to hear from and network with experts, share thinking with peers and meet our Exhibitors from the Packaging Supply Chain at the co-located exhibition. This conference aims to bring together an array of electronics systems, material, process and packaging experts as well as service providers to present a comprehensive review of the spectrum of Optoelectronics engineering.
Call for Posters
IMAPS-UK is providing a unique Poster Presentation opportunity to Academia as well as Industry based students in Session 2 of the conference. Each Poster selected will be required to give a 5 minute “Elevator” presentation to the conference, along with displaying the Poster during the whole of the day, to take advantage of discussing the contents with delegates during the networking sessions.
Appropriate Poster presentations should be focussed on Photonic and Opto Technology covering packaging issues in: IoT, 5G, FTTH, Data management and Communications applications; Relevant Nano and Microelectronic research developments in LEDS and Lasers and Luminaires; Fibre-optics, Bio-photonics, PICs and RF interfacing; Advanced Manufacturing Technologies for photonic components and systems.
Abstracts should be submitted to IMAPS-UK (firstname.lastname@example.org) by 14th SEPTEMBER latest. Places are limited to a maximum of 12 posters only.
Interested in attending POP-II as an exhibitor? A limited number of table-tops are available on a first-come, first-served basis; book early to avoid disappointment.
All exhibitors receive listings on the IMAPS-UK website, entries in the event programme, plus the opportunity to provide a short presentation to the delegates during the opening briefing at the start of the Conference.
IMAPS Corporate & THTF Member: £350 +VAT
Non Member: £500 + VAT
Please contact us if you or your Company is interested in raising its profile even further at POP-II via our Sponsorship opportunities. In addition to recognition of our sponsors at the start of the Conference, the following packages & benefits are available:
- Premier Event Sponsors: Free exhibitor table-top, two delegate places, free advert in the event handbook with promotional leaflets distributed to all delegates, logo on all promotional material and online with weblink.
- Handbook sponsors, two free full page adverts, one either inside front or back and another unspecified & one free delegate space.
|08:00||Registration and networking|
|09:00||Welcome and introductions|
|09:30||#1- Keynote presentation - "A View of Future Photonic/Microelectronic Challenges" by IQE|
|10:15||Session 1: Directions
#2 "Challenges of Fibre to the Home" - FTTH Council
#3 "5G and Big Data challenges" - Gareth Hewlett, BT
|11:05||Networking Break - Exhibition|
|11:35||Session 2: Academia – R&D
• A series of short (max 5 mins) “elevator” presentations by R&D Students/Academics
Presenters also have a Poster to enable follow up discussions
|12:45||Lunch, Exhibition and Networking|
|13:45||Session 3: Developing Applications
#4 "Pluggable Product Solutions utilising Photonic Integrated Circuits for Next-Gen Fibre Optic Telecom Systems" - Phil Mitchell - EFFECT Photonics
#5 " low cost packaging for R&D and future data developments in Terahertz wireless coms and QKD data security" - Glenn George – Bay Photonics
#6 " Flip chip, lens attachment and fibre alignment and the technical challenges ahead" - Ignazio Piacentini - FiconTEC
|15:00||Networking Break - Exhibition|
Advanced Manufacturing Technologies
#7 "Pixapp - a view "- Ana González, Pixapp Dissemination Manager
#8 "Advanced Scalable Packaging Solutions for Silicon Photonics" - Nicolas Boyer IBM
#9 "The role of the Compound Semiconductor Applications Catapult within the supply chain" - Joe Gannicliffe, CSAC Head of Photonics
|16:45||Summary and Wrap Up|
Book Event Tickets
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