Date(s) - 23/10/2018
8:00 am - 5:00 pm
IMAPS UK, in partnership with the Torbay Hi-Tech Forum, bring you the 2nd International Conference on Packaging Technology for the Photonics and the Opto components and systems industry.
The conference will meet the needs of those involved with the design of systems, development of components as well as users and will address issues of placement of die and components, Die and component Packaging for emerging
Optoelectronic technology applications. Interconnection technologies will be a key feature of the presentations and the event will offer the opportunity to learn about emerging Photonics and Opto Technology, Process tools and flows, Materials and equipment selection/options as well as the Design – Industrialisation aspects that are now required.
Don’t miss this opportunity to hear from and network with experts, share thinking with peers and meet our Exhibitors from the Packaging Supply Chain at the co-located exhibition. This conference aims to bring together an array of electronics systems, material, process and packaging experts as well as service providers to present a comprehensive review of the spectrum of Optoelectronics engineering.
Interested in attending POP-II as an exhibitor? A limited number of table-tops are available on a first-come, first-served basis; book early to avoid disappointment.
All exhibitors receive listings on the IMAPS-UK website, entries in the event programme, plus the opportunity to provide a short presentation to the delegates during the opening briefing at the start of the Conference.
IMAPS Corporate & THTF Member: £350 +VAT
Non Member: £500 + VAT
Please contact us if you or your Company is interested in raising its profile even further at POP-II via our Sponsorship opportunities. In addition to recognition of our sponsors at the start of the Conference, the following packages & benefits are available:
- Premier Event Sponsors: Free exhibitor table-top, two delegate places, free advert in the event handbook with promotional leaflets distributed to all delegates, logo on all promotional material and online with weblink.
- Handbook sponsors, two free full page adverts, one either inside front or back and another unspecified & one free delegate space.
|08:00||Registration and networking|
|09:00||Welcome and introductions|
|09:30||Industry keynote presentation|
|10:15||Session 1: Directions
• Systems and Processes
• Big Data
|11:05||Networking Break - Exhibition|
|11:35||Session 2: Academia – R&D
• A series of short (max 5 mins) “elevator” presentations by R&D Students/Academics
Presenters also have a Poster to enable follow up discussions
|12:45||Lunch, Exhibition and Networking|
|13:45||Session 3: Developing Applications
• Data centres
|15:00||Networking Break - Exhibition|
Advanced Manufacturing Technologies
• Sub-Micron Alignment
• Heterogeneous Integration
• Wafer Scale Packaging
|16:45||Summary and Wrap Up|
Book Event Tickets
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