Download the post event report here: PoP2_conference_review-report.pdf (775 downloads)
Agenda | Exhibitor Opportunities | Sponsorship Opportunities | Book Now | Event flyer | Call for Posters
IMAPS UK, in partnership with the Torbay Hi-Tech Forum, bring you the 2nd International Conference on Packaging Technology for the Photonics and the Opto components and systems industry.
The conference will meet the needs of those involved with the design of systems, development of components as well as users and will address issues of placement of die and components, Die and component Packaging for emerging
Optoelectronic technology applications. Interconnection technologies will be a key feature of the presentations and the event will offer the opportunity to learn about emerging Photonics and Opto Technology, Process tools and flows, Materials and equipment selection/options as well as the Design – Industrialisation aspects that are now required.
Don’t miss this opportunity to hear from and network with experts, share thinking with peers and meet our Exhibitors from the Packaging Supply Chain at the co-located exhibition. This conference aims to bring together an array of electronics systems, material, process and packaging experts as well as service providers to present a comprehensive review of the spectrum of Optoelectronics engineering.
This event is also supported by EPIC and IEEE-EPS as a partner organisations.
(Reduced event prices are offered for Partner members)
Interested in attending POP-II as an exhibitor? A limited number of table-tops are available on a first-come, first-served basis; book early to avoid disappointment.
All exhibitors receive listings on the IMAPS-UK website, entries in the event programme, plus the opportunity to provide a short presentation to the delegates during the opening briefing at the start of the Conference.
IMAPS Corporate & THTF Member: £350 +VAT
Non Member: £500 + VAT
Please contact us if you or your Company is interested in raising its profile even further at POP-II via our Sponsorship opportunities. In addition to recognition of our sponsors at the start of the Conference, the following packages & benefits are available:
- Premier Event Sponsors: Free exhibitor table-top, two delegate places, free advert in the event handbook with promotional leaflets distributed to all delegates, logo on all promotional material and online with weblink.
- Handbook sponsors, two free full page adverts, one either inside front or back and another unspecified & one free delegate space.
|08:00||Registration and networking|
|09:00||Welcome and introductions|
|09:30||#1- Keynote presentation - "Compound Semiconductor Materials: Enabling Pervasive Photonics and Microelectronics-based Applications" Dr Iwan Davies - Group Technology Director, IQE|
|10:15||Session 1: Directions
#2 "Packaging Directions - An Overview" - Andy Longford, PandA Europe
#3 "Photonics Packaging Challenges – Old and New" - Bob Musk, Entroptix Ltd.
|11:05||Networking Break - Exhibition|
|11:35||Session 2: Technology Development
#4 "5G and Big Data challenges" - Gareth Hewlett, BT
#5 "Packaging developments for Compound Semiconductor Focal Plane Arrays." - Professor Chris Bailey, University of Greenwich
#6 "Using 3D Electron Microscopy at the nano-scale for new product development" - Dr Yang Liu & Claire Pearce, Plymouth Electron Microscopy Centre, University of Plymouth
|12:45||Lunch, Exhibition and Networking|
|13:45||Session 3: Developing Applications
#7 "Pluggable Product Solutions utilising Photonic Integrated Circuits for Next-Gen Fibre Optic Telecom Systems" - Phil Mitchell - EFFECT Photonics
#8 "Low cost packaging for R&D and future data developments in Terahertz wireless coms and QKD data security" - Glenn George – Bay Photonics
#9" Recent advances in automated manufacturing equipment for photonics assembly and testing" - Thomas Danger - ficonTEC
|15:00||Networking Break - Exhibition|
Advanced Manufacturing Technologies
#10 "Packaging technologies to scale-up production for PIC-based products, PIXAPP Pilot Line"- Ana González, Pixapp Dissemination Manager, R&D Manager at EPIC.
#11 "Advanced Scalable Packaging Solutions for Silicon Photonics" - Nicolas Boyer, Advisory engineer, Advanced Optical Packaging Development, IBM.
#12 "The role of the Compound Semiconductor Applications Catapult within the Supply Chain" - Joe Gannicliffe, Head of Photonics at the CSA Catapult.
|16:45||Summary and Wrap Up|
Transport & Accommodation:
Devon is conveniently available for transport links from the rest of the UK, being served by Flights to Exeter Airport, fast train services from London, Bristol and other UK National centres and Road access from the M5 motorway
There are a large number of hotels within a radius of 5 miles away from the South Devon College.
The Premier Inn: Paignton South -(White Rock, Long Road South, Paignton, TQ4 7RZ)
is within walking distance. This can be booked via the Premier Inns website.
The College is served by the Local #22 bus service (available from Paignton Train Station).
Book Event Tickets
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
Bookings are now closed for this event. - Please contact the IMAPS-UK office for further details
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Date(s) - 23/10/2018
8:00 am - 5:00 pm
South Devon College, Paignton, TQ4 7EJ