IMAPS-UK Altogether, better connected!

Power and High Temperature Free Online Conference

Thursday 28 May 2020

Electronics Manufacturing Challenges and Solutions for the Electric Revolution

IMAPS-UK will hold a free one day Online Conference on Thursday 28 May 2020 on the topic of Power and High Temperature, where you can learn about the latest developments in materials and assembly processes to address the challenges of extending the temperature capabilities of micro-electronics for the Electric Revolution.

ThisĀ Online Conference will cover all aspects of designing, manufacturing and testing of power and high temperature electronics, where miniaturisation, thermal management, electrical performance and reliability are critical features that need to be optimised.

5 key reasons to attend:

  • End User Requirements – hear about the challenges facing transportation and industrial applications
  • Substrate Technologies – overcoming thermal management issues
  • Sintering Materials – a viable alternative to solders and adhesives?
  • Materials Testing – ensuring long term reliability and fitness for purpose
  • Manufacturing Solutions – proven processes for extended temperature performance


Presentations will include challenges for Driving the Electric Revolution, high temperature interconnect materials, power electronics assembly, substrate materials, sintering processes, high temperature control and thermal management.

The Agenda is presented below.

09:25Welcome and Introduction to IMAPS-UK
09:30Session 1:
1: Driving the Electric Revolution - Building UK Supply Chains for PEMDMartyn Cherrington, Innovate UK
2: Can high temperature materials and processes be applied to power electronics packagingSteve Riches, Tribus-D Ltd
3. Packaging and Integration Solutions for Wide Band-Gap Power ElectronicsMark Johnson, Nottingham University
11:30Session 2:
4: High Temperature Interconnect MaterialsAarief Syed-Khaja, Heraeus
5: Introducing the All Copper Interconnect TechnologyRichard Dixon, Dycotec Materials
13:30Session 3:
6: PCB Substrates and Methods for High Temperature ApplicationsTom Bisset, Daleba
7: High Temperature and High Vibration Electronics ManufacturingJohn Boston, CIL
8: Materials Testing at Elevated Temperatures/Power CyclingMartin Wickham, NPL
15:30Session 4:
10: Moving Control Systems to the "Hot, Sweaty Heart of the Action"Piers Tremlett, Microchip
11: Controlled Expansion Alloys for Thermal Management ApplicationsStuart Sillars, Osprey Sandvik
16:30Closing Remarks and End

Download the Power and High Temperature Conference Booklet (627 downloads )

Conference Registration:

Please register for the Conference HERE.

There is no charge to attend the Conference.

For further information, please contact IMAPS-UK Office