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Probing Failure Analysis Techniques for Device and Package – Monday 9 May 2022 @ 13:00 UK

This IMAPS-UK Online Technical Showcase is “Probing Failure Analysis Techniques for Device and Package” by Greg Johnson of ZEISS Microscopy.

This is a free to join event, please log in or register below to book a place.

Probing Failure Analysis Techniques for Device and Package
Greg Johnson – ZEISS Microscopy

Probing is on the Rise! Probing has gained momentum with new applications in semiconductor manufacturing and development, from device to package. Probing techniques such as nanoprobing, Electron Beam Induced Current (EBIC), Electron Beam Induced Resistance CHange (EBIRCH), as well as methods enabled by Atomic Force Microscopy (AFM) have become increasingly important parts of the failure analysis toolkit.

Greg Johnson – Senior Applications Development Engineer, ZEISS Microscopy

This talk will be given by Greg Johnson of ZEISS Microscopy, a failure analysis engineer with 19 U.S. patents and decades of experience in defect localisation and semiconductor process development. Among the topics covered will be a review of the 2021 IPFA Best FA Paper, “Low-Voltage EBIC Investigation of Fails”. The talk will cover low stress ways to characterise transistors and will also look to some applications for packaging.

Registration details (name/organisation) will be shared with the ZEISS Microscopy, please e-mail the IMAPS-UK Office, if you have any objections to this.

Please follow the link to subscribe to ZEISS Microscopy News

Once registered, you will receive Joining Instructions by e-mail 2-3 days before the event. Bookings can be accepted up to 1 hour prior to the event start

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When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .

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Date(s) - 09/05/2022
1:00 pm - 2:00 pm

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