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Professional Development Course – Wafer and Package Dicing Technology for the Electronics Packaging Industry : 20 -25 May 2021

An Opportunity for In-Depth Online Training in May 2021, presented by Andy Longford of PandA Europe.

Sawing is the first and most critical step in the die processing operation. There are many variables involved in sawing process such as wafer thickness, the width of the saw streets, the metal composition of the wafer, and the die size. Factors such as blade speed, cutting patterns, or even the electrical charge carried by the DI water used can have a significant impact on the yield of the sawn dice. The wafer dicing process yield is optimised through the proper selection of the dicing blade. Failure to perform the process correctly can cause mechanical damage to the die.

The objective of this course is to introduce engineers and technicians to the basic principles and options of the various dicing methods and its functions. This course will expose the participants to the various dicing technology such as blade dicing, laser dicing and stealth dicing for both wafer and package technology. In this 4 half-day online webinar, the issues and problem solving for the various defect types and causes will be addressed. The highlights of this workshop are the case studies as well as the video presentations of the different dicing processes. It is important to understand how these techniques work to enable participants to gain a good understanding, practical experience, and continuous-improvement knowledge to be well equipped to champion the dicing process in their organisation.

This Professional Development Course will be run over 4 days in sessions of 4 hours each to provide a comprehensive review of Dicing Technology, covering the following topics:

  • Introduction to Dicing
  • Dicing Technology Overview
  • Blade Dicing
  • Dicing Solutions
  • Laser Dicing
  • New Technologies
  • Issues and Problem Solving
  • Recap, Review and Summary

Event Flyer Download Wafer and Packaging Dicing Technology Professional Development Course (96 downloads)

Download Professional Development Course - Dicing Technology Video (36 downloads)

Who Should Attend?

  • Wafer Dicing Engineers and Technicians
  • Package Dicing Engineers and Technicians
  • Process Engineers
  • FEA Engineers
  • Materials Engineers
  • Quality Control Engineers
  • Reliability Engineers
  • Managers

Registration for Professional Development Course on Dicing Technology is open below.

  • IMAPS-UK and IMAPS Worldwide Member: £450
  • IMAPS-UK Student (Postgraduate and Undergraduate): £300
  • Non-Member: £650

Prices shown are exclusive of VAT.

For further information, please contact:

IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004
Email: office@imaps.org.uk

Book Event Tickets

When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .

Bookings are now closed for this event. - Please contact the IMAPS-UK office for further details

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Date/Time
Date(s) - 20/05/2021 - 25/05/2021
1:00 pm - 5:00 pm

Location
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