RaMPoP Conference: Thursday 26 November 2026 at the Semiconductor Catapult, Newport
The RF, Microwave and Photonics Packaging (RaMPoP) Conference will be held on Thursday 26th November 2026 at the Semiconductor Catapult, Newport, South Wales, NP10 8BE
Assembly and Packaging is necessary to make RF, microwave and photonics devices reliable and manufacturable products. As operating frequencies push into the mmWave band and beyond and signals cross between the electrical and optical domains, the package itself becomes a critical part of the circuit – setting the limits on electrical and optical performance, thermal management, reliability and cost. This makes assembly and packaging a natural unifying theme across RF, microwave and photonics applications. This conference will bring together equipment, material and manufacturing suppliers with both R&D and user requirements to further the available capabilities in this advanced technology sector.
Call for Abstracts
IMAPS-UK invites abstracts covering the following topics:
- Materials & substrates – low-loss laminates, LTCC/HTCC ceramics, glass and organic interposers
- Interconnects & transitions – flip-chip vs. wire bond, low-loss RF/mmWave transitions and vertical interconnects
- Thermal management – heat spreading and die-attach for high-power RF, Opto and Photonic devices and laser sources
- Hermeticity & reliability – sealing, moisture control and environmental/space qualification
- Photonic integration – fibre alignment and attach, electro-optic co-packaging and hybrid RF-photonic assembly
- Modelling, test & EMC – multiphysics co-design, shielding, grounding and antenna-in-package
Please submit your Title and Abstract of up to 200 words to office@imaps.org.uk by Friday 11th September 2026
Registration for RaMPoP Conference
Registration for the RaMPoP Conference is open below:
- IMAPS-UK (and IMAPS Worldwide) Member: £85 – Book Ticket RAMPOP26-01
- Non Member: £155 Book Ticket RAMPOP26-02
- Students and Poster Doctoral Researchers (PDRs): £30 – Book Ticket RAMPOP26-03
- Students – First 10 places are available for free: £0 (free) Book Ticket RAMPOP26-03F
Prices shown are exclusive of VAT.
Travel Fund for PhD and Undergraduate Students – Open for Application
IMAPS-UK is pleased to announce that some funds are available to support economy rail travel costs for UK-based Undergraduate and PhD students attending the RAMPoP Conference, subject to an eligible case being submitted by PhD and Undergraduate Supervisors. The Supervisor will need to e-mail the IMAPS-UK Office to confirm that their student does not have access to institutional funds to cover travel costs. Applications will be responded to as soon as possible.
Sponsorship Opportunity at RaMPoP Conference
IMAPS-UK is pleased to offer a Sponsorship opportunity at the RaMPoP Conference
The Sponsorship Package includes:
- One complete Exhibitor Package (see below)
- Place for one additional person with full access to the Conference
- Opening speaking slot (up to 5 minutes length)
- 1 full A4 advert in the Event Programme (PDF)
- Logo and links on all promotion documents and website
The Sponsorship Package is offered at £1200 (exc VAT) – Book Ticket RAMPOP26-06.
Exhibiting at the RaMPoP Conference
Interested in attending RaMPoP as an exhibitor?
The Exhibitor package offers:
- Place for one person with full access to the Conference
- A 200 word description in the Event Programme (PDF)
- A table top display with room behind for two pop-up banners
- Logo and Links to company on event promotion and website
- Short introduction to the delegates during the Conference
Exhibitor Rates:
- IMAPS-UK Corporate Member Exhibitor: £350 – Book Ticket RAMPOP26-04
- Non Member Exhibitor: £500 – Book Ticket RAMPOP26-05
Prices shown are exclusive of VAT.
Microelectronics Packaging Workshop – Wednesday 25 November 2026 at the Semiconductor Catapult
Microelectronics packaging techniques are crucial for ensuring the functionality, reliability and longevity of electronic devices. Packaging provides protection, interconnection and thermal management of electronic devices. This workshop provides the opportunity to learn about microelectronics packaging techniques and their application.
Starting with a Networking Lunch at 12:00, and followed by the Workshop introduction, the afternoon talks will cover the main packaging processes and methods, including:
- Wafer Preparation
- Die Attach and Interconnection
- Encapsulation and Package Options
- Test and Inspection
For further information and booking, please visit the Microelectronics Packaging Workshop Event Page
Consent:
I confirm that my name and institution/organisation can be included in the attendee list in the delegate pack and shared with the Semiconductor Catapult.
Please e-mail the IMAPS-UK Office if you have an objection to the above consent.
Cancellation Policy
Please click on Cancellation Policy for information on cancellations for bookings
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For further information, please contact:
IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004
Email: office@imaps.org.uk
Book Event Tickets
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
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Date/Time
Date(s) - 26/11/2026
8:00 am - 5:00 pm
Compound Semiconductor Applications Catapult
