RELPACK 2017 – Reliability Engineering for Electronic Packaging
Download the post event report here: RelPack2017_Report_BM.pdf (1455 downloads) “
About RELPACK 2017 :
The reliability of electronics is almost taken for granted, with a few notable exceptions, which hit the headlines around the world. Behind the scenes, extensive work is carried out to prove the reliability of electronic components/modules and demonstrate their fitness for purpose from consumer products through to safety critical applications in medical, automotive and aerospace.
Packaging and assembly processes are key elements governing both the manufacturing reliability and longevity of electronic products, but the science and engineering in determining reliability are often overlooked in satisfying minimum qualification requirements.
This conference aims to bring together an array of electronics packaging experts and reliability service providers to present a comprehensive review of the spectrum of reliability engineering, including modelling to predict lifetimes, design for reliability, importance of hermeticity, failure analysis methods, ruggedisation of standard electronic products, highly accelerated life testing and reliability testing for wearables and the Internet of Things.
Event Brochure:
Download a PDF version of the event brochure HERE
Agenda:
| Start | Details |
| 08:30 | Registration, Exhibition & Networking |
| 09:15 | Welcome, Introduction and Exhibitor Briefings |
| 1 - Keynote - What is Reliability Testing in Today’s Competitive Low Cost Materials - Martin Shaw, Reliability Solutions | |
| Session One: Design and Modelling | |
| 2 - Materials design for inherent harsh environment reliability - Colin Johnston, Oxford University | |
| 3 - Modelling for Reliability and Lifetime Prediction - Chris Bailey, University of Greenwich | |
| 4 - The Use of Thermal Warpage Metrology Methods in Electronic Reliability Testing - Neil Hubble, Akrometrix | |
| Session Two: Reliability Testing and Failure Analysis | |
| 5 - Same-sample characterisation of thermal and electrical degradation in power electronic modules subjected to temperature and power cycling - Mark Johnson, Nottingham University | |
| 6 - Use of design of experiments for qualitative accelerated life testing of next-generation solar cells - Jeff Kettle - University of Bangor | |
| 7 - Reliability Testing for Wearables - Martin Wickham/Adam Lewis - NPL | |
| 8 - Failure analysis methods and case studies - Stewart McCracken - MCS | |
| Session Three: How to Improve Reliability | |
| 9 - Hermeticity testing and lifetime prediction for medical devices - Anne Vanhoestenberghe, UCL | |
| 16:30 | 10 - Hermetic glass packaging for demanding applications - Ville Hevonkorpi, Primoceler |
Who Should Attend:
End-Users, Manufacturers, Production & Manufacturing Engineers, Researchers & Developers, Scientists, Supply Chain Companies, Reliability and Quality Engineers, Failure Analysis Engineer, Process Engineers, Product Designers & Students etc.
Delegate Registration:
Join us at this prestigious one day event to learn, network and source in the field of reliability engineering for electronics packaging.
The event is open to all including non members, the following delegate rates apply:
IMAPS-UK Member: £75
IMAPS-UK Student Member: £45
Non Member: £125
All prices plus VAT and inclusive of free parking, lunch & refreshments.
**** REGISTRATION NOTICE:
ALL REGISTRATIONS MUST BE DONE ON AN INDIVIDUAL BASIS IN ORDER FOR REGISTRANTS TO BE ABLE TO ACCESS THE EVENT AND RECEIVE EVENT INFORMATION, INCLUDING ACCESS TO DOWNLOADS.
WE THANK YOU FOR YOUR CO-OPERATION WITH THIS.
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Exhibit at RELPACK 2017:
Interested in attending RELPACK 2017 as an exhibitor? A limited number of table-tops are available on a first-come, first-served basis; book early to avoid disappointment.
All exhibitors receive listings on the IMAPS-UK website, entries in the event programme, plus the opportunity to provide a short presentation to the delegates during the opening briefing at the start of the Seminar.
Exhibitor Rates: IMAPS Corporate Member: £350, Non Member: £500
Accommodation:
A number of Hotels are available in the area. The following are suggested:
- Daresbury Park Hotel & Spa
- The Park Royal – QHotels 4-star hotel Warrington (2.6 miles from Daresbury)
- Holiday Inn Runcorn M56 Junction 12 4-star hotel (3 miles from Daresbury)
- Campanile Hotel Runcorn 2-star hotel (4.3 miles from Daresbury)
- Hallmark Hotel Warrington (4.5 miles from Daresbury)
- The Old Hall Hotel 3-star hotel at Frodsham (4.7 miles from Daresbury)
EVENING DINNER
IMAPS-UK will organise a dinner venue on the evening of Wednesday 29 November at the Ring O’Bells Daresbury. This will be bookable via the website or directly with the Secretariat at £35.00 (plus VAT) per head including a welcome drink. Please note, the number of places will be limited to around 40 persons only.
For further information, please contact:
IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004
Email: andy.longford@imaps.org.uk
Please note: Payment for tickets to IMAPS-UK events is completed via the PayPal gateway, either as a “Guest” using the “Debit/Credit Card” option, or using an existing PayPal account.
Book Event Tickets
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
Bookings are now closed for this event. - Please contact the IMAPS-UK office for further details
Paying by Credit/Debit Card - Click the Pay by Stripe button.
Payment for tickets to IMAPS-UK events is completed via the Stripe gateway
Date/Time
Date(s) - 30/11/2017
All Day
STFC - Daresbury Laboratory
