Dicing Technology (for Semiconductor & Packaging Applications)
Event Report
Download the post event report HERE
Description
This educational Workshop, organised by IMAPS-UK is being held at a venue close to the Micross facility. It is your opportunity to learn about and understand the technologies being utilised for dicing Semiconductor and other materials used in packaging and assembly of Electronics.
Dicing is usually the first step of getting a product design out from the wafer fab and into a form where it can be used or packaged as a stand alone item. As die sizes decrease the dicing technologies are being pushed to and beyond typical technology limits.
The programme will consist of 5 workshop sessions covering all aspects of the dicing process as highlighted above and will include case studies covering a range of related applications and technologies. This will be followed by a short tour (if desired) of the Micross Norwich Facility.
The workshop, which will be limited in numbers, is aimed at electronic component and system developers, manufacturers and end-users as well as design companies that now need to understand this very important technology area. It will review the key issues dicing applications currently used in electronics and device packaging.
The workshop will cover an introduction to the principles of dicing technology, including:
Mechanical dicing
Laser ablation
Stealth Dicing
Plasma Dicing
Agenda
| Start | Finish | Duration | Details |
| 08:30 | Registration & Coffee | ||
| 09:00 | Welcome & Introduction | ||
| 09:15 | Session 1 –“Basics of Dicng” - Andy Longford -PandA Europe | ||
| 10:00 | Session 2 – “Blade Technologies” - John Govier - Inseto | ||
| 10:45 | Networking Break | ||
| 11:30 | Session 3 – “Dicing Equipment and Capabilities” - Christoph Epple - Disco | ||
| 12:30 | Lunch & Networking | ||
| 13:15 | Micross Facility Tour | ||
| 14:00 | Session 4 – "New Dicing Technologies" | ||
| a) Laser Technologies - Andy Longford - PandA Europe | |||
| b) Plasma - Richard Barnett - SPTS | |||
| 15:00 | Networking Break | ||
| 15:30 | Session 5 – Application Case Studies | ||
| a) Micross | |||
| b) FSL - Fico | |||
| c) Inseto - ADT | |||
| d) Plasma-Therm | |||
| 16:50 | Workshop Wrap-up | ||
| 17:00 | End of workshop |
Who Should Attend?
Research & Development Related Personnel, HR Recruitment Managers & Directors, Scientists, Production, Manufacturing & Technical Engineers/Managers & Directors, Supply Chain Companies, Process Engineers, Product Designers & Students.
Book Event Tickets
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
Bookings are now closed for this event. - Please contact the IMAPS-UK office for further details
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Date/Time
Date(s) - 19/05/2016
8:30 am - 5:00 pm
Mercure Hotel
