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Dicing Technology (for Semiconductor & Packaging Applications)

Date/Time
Date(s) - 19/05/2016
8:30 am - 5:00 pm

Location
Mercure Hotel

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Event Report
Download the post event report HERE

Description
This educational Workshop, organised by IMAPS-UK is being held at a venue close to the Micross facility. It is your opportunity to learn about and understand the technologies being utilised for dicing Semiconductor and other materials used in packaging and assembly of Electronics.

Dicing is usually the first step of getting a product design out from the wafer fab and into a form where it can be used or packaged as a stand alone item. As die sizes decrease the dicing technologies are being pushed to and beyond typical technology limits.
The programme will consist of 5 workshop sessions covering all aspects of the dicing process as highlighted above and will include case studies covering a range of related applications and technologies. This will be followed by a short tour (if desired) of the Micross Norwich Facility.
The workshop, which will be limited in numbers, is aimed at electronic component and system developers, manufacturers and end-users as well as design companies that now need to understand this very important technology area. It will review the key issues dicing applications currently used in electronics and device packaging.

The workshop will cover an introduction to the principles of dicing technology, including:

Mechanical dicing
Laser ablation
Stealth Dicing
Plasma Dicing

Agenda

StartFinishDurationDetails
08:30Registration & Coffee
09:00Welcome & Introduction
09:15Session 1 –“Basics of Dicng” - Andy Longford -PandA Europe
10:00Session 2 – “Blade Technologies” - John Govier - Inseto
10:45Networking Break
11:30Session 3 – “Dicing Equipment and Capabilities” - Christoph Epple - Disco
12:30Lunch & Networking
13:15Micross Facility Tour
14:00Session 4 – "New Dicing Technologies"
a) Laser Technologies - Andy Longford - PandA Europe
b) Plasma - Richard Barnett - SPTS
15:00Networking Break
15:30Session 5 – Application Case Studies
a) Micross
b) FSL - Fico
c) Inseto - ADT
d) Plasma-Therm
16:50Workshop Wrap-up
17:00End of workshop

Who Should Attend?
Research & Development Related Personnel, HR Recruitment Managers & Directors, Scientists, Production, Manufacturing & Technical Engineers/Managers & Directors, Supply Chain Companies, Process Engineers, Product Designers & Students.

CPMT JEMI

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