26-28 June, Hilton Hotel, Dresden
The SEMI 3D & Systems Summit this year is dedicated to Smarter Systems through Heterogeneous Integration. The semiconductor industry has had several changes in market, products, and tech advancements brought by disruptive technologies and Moore’s Law plateauing. Therefore, continued developments and innovation are essential to growing the business.
Industry experts will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.
Participants can enjoy the exclusive exhibition areas that will feature the most prominent names in the industry alongside new and innovative companies.
Several B2B matching opportunities await during the conference, including networking reception, coffee breaks, lunches, and a unique Networking Dinner Cruise at the beautiful Elbe River.
For full details, go to https://www.semi.org/eu/connect/events/3d-and-systems-summit