IMAPS-UK Altogether, better connected!

Semiconductor Packaging IMAPS-UK Webinar

Date/Time
Date(s) - 19/09/2019
2:00 pm - 3:30 pm

Location
On-Line

Categories

The next  IMAPS-UK Webinar is … “ Semiconductor Packaging”
19th September 2019 @ 14.00

This is a free to join event      –   Book your place here

PLEASE NOTE EARLIER THAN NORMAL START TIME @ 14.00 BST

This is the fourth in a series of webinars organised by IMAPS (International Microelectronics, Assembly and Packaging Society) to showcase presentations given at previous IMAPS events. The series will be continued by Steve Riches and Liam Mills, and the presentations were first given at the IMAPS “Semiconductor Packaging Workshop” in Newport in June 2019.

“Introduction to Electronic Substrates”
Steve Riches –Tribus-D Ltd

The electronic substrate provides conductor paths, voltage isolation, heat dissipation, a base for mounting of components, connections and some mechanical and environmental protection. Although most applications use surface mount components assembled onto printed circuit boards, there is a myriad of other options available to the electronic designer. Future electronics applications will place additional demands on the substrate materials in order to achieve increasing levels of integration and miniaturisation at an affordable cost.

This presentation will summarise the factors relating to the selection of electronic substrate materials and introduce some of the directions that current research and development initiatives are addressing.

Steve Riches –Director Tribus-D Ltd: Steve Riches received a BA (Hons) in Natural Sciences from the University of Cambridge. He has over 30 years of experience in electronics assembly innovation, proposal generation and project management. Technical developments have included copper wire bonding, laser processes, high temperature electronics, MEMS assembly, ruggedised displays and LED lighting working at The Welding Institute and GE Aviation Systems in Newmarket. He has instigated and managed several Innovate UK/European projects, working collaboratively with a wide range of industrial and academic partners. He left GE Aviation in December 2015 and is now a director at a start-up business, Tribus-D Ltd, working on developing innovative electronic packaging and interconnection technologies.

“Die attach and Interconnects”

Liam Mills –Technical Specialist, Electronics Manufacturing, Manufacturing Technology Centre (MTC)
This presentation discusses the Die attach and Interconnects aspects which are two of the most critical processes for Semiconductor packaging and are therefore vital to get it right first time to ensure quality and reliability. As every application has different requirements, there is also a wide range of die attach and interconnect technologies available. This first half of the session will focus on Pb-free die attach options, their processes and associated failure modes, including a review of the latest sinter materials. The second half of the session will focus on interconnect technologies and their limitations, including a review of double sided bonding as an alternative for wirebonds.

Liam Mills – Manufacturing Technology Centre (MTC): Liam received a BEng (Hons) in Aerospace Engineering from the University of Liverpool in 2005. Soon after graduating he joined TT Electronics where roles in Quality, Power Module design and R&D provided the foundation to a career in semiconductor packaging during his 13 years with the company. Technical developments were focused on materials and assembly processes for high temperature electronics and improving reliability of solder joints and wirebonds for Power Electronics for harsh environments, primarily focused on Aerospace applications. He has managed numerous UK/EU funded programmes working collaboratively with a wide range of academic and industrial partners. He left TT Electronics in November 2018 and is now working across a broad range of electronics manufacturing research topics ranging from micro and power electronics assemblies to novel circuit board assembly processes for all market sectors at MTC.

Book your place here

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Webinar will run for between 60-90min with a question and answer session. The webinars are limited to 100 delegates/companies