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Semiconductor Packaging Reliability Explained Workshop: Tuesday 9 April 2024 CSA Catapult

A Workshop on Semiconductor Packaging Reliability Explained!

IMAPS-UK is organising a Training Workshop to provide an understanding of Semiconductor Packaging Reliability and how it can be applied in advanced medical and automotive electronics. This Afternoon Workshop follows on from the Official Opening of the Advanced Packaging Facility at the CSA Catapult featuring ceramic and metal 3D printing capability and metrology equipment which starts at 11:00 on Tuesday 9 April 2024, to which Registered Workshop Attendees are invited.

Official Opening of the South West and Wales Driving the Electric Revolution Industrialisation Centre (DER-IC) Lab

The Compound Semiconductor Applications (CSA) Catapult will welcome stakeholders from industry, academia and government to its official opening of the DER-IC Lab on Tuesday 9th April 2024.

This exclusive event will showcase CSA Catapult’s state-of-the-equipment now available in Newport and accessible across the UK.

The Catapult team will highlight how their expertise and capabilities can meet partners’ bespoke requirements to overcome challenges faced by the Power, Electronics, Machines and Drives (PEMD) industry, and create the energy efficient devices required for a Net Zero future.

As the South West and Wales DER-IC, CSA Catapult received £1.6M from the Driving the Electric Revolution Challenge to develop the lab as a prototype facility for ceramic and copper elements, and sub-assemblies for integrated modules.

The suite of advanced 3D printing equipment is the UK’s first in an open access lab enabling combination, mixed metal and ceramic printing to be applied to chip packages, heat sinks and PCB designs.

The equipment includes:

  • A multi-material 3D printer that can quickly prototype novel packages using ceramic and mixed material for higher power and performance packaging
  • A 3D metal printer which can create fast prototypes for embedded package and module using copper or other conductive materials
  • An optimised laser system that can dice and drill semiconductor and ceramic materials for novel package designs

The opening event will consist of keynote talks, an opening ceremony, tours and technical demonstrations. Guests will have the opportunity to network with key stakeholders and discuss potential collaborations.

Semiconductor Packaging Reliability Explained! Workshop

Semiconductor Packaging covers a broad spectrum of packaging solutions that include Flip Chip, Fan Out Wafer Level Packaging, Hybrid Packaging, System in Package, 2.5D/3D and many sub-categories with higher interconnection densities than traditional wire bonding. Challenges include power delivery signal integrity, multi-physics impacts, IP block interface standards, chiplet manufacturing considerations, warpage and many others. The traditional 2D mindset for device integration in packaging is rapidly changing and a 3D or vertical mindset is becoming a key driver for High Performance Computing, AI, Mobile Products and Power Electronics.

This workshop will focus on the fundamentals of Semiconductor Packaging Reliability, initially exploring the opportunities for Advanced Packaging, then followed by examining the reliability and qualification aspects of packaged semiconductors in medical and automotive applications.

The workshop will address the training needs of students and researchers within Colleges and Universities and personnel within Industrial companies to assist in the upskilling and reskilling of people for the design, manufacture and testing of electronics modules. Attendees can request a Certificate of Attendance that can be used as proof of Continuous Professional Development.

This Training Workshop will be delivered by Jonathan Abdilla of BESI, Professor Layi Alatise of the University of Warwick and Professor Anne Vanhoestenberghe of King’s College London and will be run in half-day session, starting at 13:15 and finishing by 16:15.

The Semiconductor Packaging Reliability Workshop will cover the following topics:

  • Introduction to Advanced Packaging Opportunities
  • Reliability and Qualification of Packaged Semiconductors for Automotive Applications
  • Reliability of Active Implantable Devices

Download the Semiconductor Packaging Reliability Explained Workshop Flyer


Registration for the Training Workshop is now full.

If you are interested in being placed on a reserve list in case of dropouts, please e-mail the IMAPS-UK Office.


I confirm that my name and institution/organisation can be included in the attendee list in the delegate pack and shared with the CSA Catapult.

Please e-mail the IMAPS-UK Office if you have an objection to the above consent.

Cancellation Policy

Please click on Cancellation Policy for information on cancellations for bookings


For further information, please contact:

IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004

Book Event Tickets

When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .

This event is fully booked.

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Date(s) - 09/04/2024
11:00 am - 4:00 pm

Compound Semiconductor Applications Catapult
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