Download the post event report here: ThePackagingWorkshopReport.pdf (414 downloads)
THIS EVENT WAS FULLY BOOKED – SORRY IF YOU WERE DISAPPOINTED ON THIS OCCASION.
There will be further packaging events in the future, but please also consider booking for the other IMAPS-UK events that we are running.
This educational Workshop event organised by IMAPS-UK delivered tutorials and case studies as an overview of some basic packaging techniques including die bond and wire bond, as well as a taster of some more advanced techniques. The Workshop, was aimed at an audience consisting of chip or board designers and those either wishing to learn more or those new to the microelectronics packaging industry.
“The Packaging Workshop” was supported by its hosts, Airbus Defence and Space, Portsmouth. It included facility tours, plus a Packaging Surgery, where industry experts advised on packaging issues raised by delegates attending the event.
Event brochure (PDF)
Event report (PDF)
Event presentations are available to registered attendees. Please use the ‘Members’ -> ‘Downloads’ menu, then select “The Packaging Workshop 2017 >” to access. You must be logged in using the same user account as you used to register for the event.
|Session 1:||Die attach|
|Tutorial: Glue attach - Alastair Attard (BESI)|
|Tutorial: Metallic attach - Steve Riches (Tribus-D)|
|Case study: Title TBC - Bob Hunt (ULTRA CEMS)|
|Case study: Title TBC - Tony Winster (Henkel)|
|Tutorial: Introduction to wirebonding - Steve Riches (Tribus-D)|
|Tutorial: Ball bonding - Simon Broadhurst (Kulicke & Soffa)|
|Tutorial: Wedge bonding - Speaker TBC (Hesse Mechatronics)|
|Case study: Gold tape bonding on ceramic substrates - Speaker TBC (Airbus Defence and Space)|
|Session 3:||Facility tours and packaging surgery.|
|Session 4:||Advanced packaging taster|
|Tutorial: Introduction to advanced packaging - Piers Tremlett (Microsemi)|
|Tutorial: Plasma chemistry for micro-electronic packaging - John Maguire (Nordson MARCH)|
|Tutorial: Future packaging trends - Speaker TBC (STATS ChipPAC)|
Who Should Attend?
Production Operators and Technicians, Research & Development Personnel, Product Designers, Recruitment Personnel, Students, Manufacturing & Technical Engineers, Supply Chain Companies, Process Engineers.
The event is open to all including non IMAPS-UK members, the following delegate rates apply:
IMAPS-UK Member: £155
IMAPS-UK Student Member: £125
Non Member: £195
Partner member: £175
All prices plus VAT and inclusive of free parking, lunch & refreshments.
For further information, please contact:
Telephone: + 44 (0)131 202 9004
Please note: Payment for tickets to IMAPS-UK events is completed via the PayPal gateway, either as a “Guest” using the “Debit/Credit Card” option, or using an existing PayPal account.
Book Event Tickets
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
This event is fully booked.
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Payment for tickets to IMAPS-UK events is completed via the Stripe gateway
Date(s) - 28/09/2017
9:00 am - 4:30 pm