Download the post event report here: SPW_workshop_event-report.pdf (181 downloads)
This Semiconductor Packaging workshop …. brings together an array of electronics packaging experts and practitioners to present a comprehensive review of key Semiconductor packaging technologies including package and substrate options, die preparation, attach and interconnection techniques.
The event provides training for staff who need to be aware of the benefits of employing basic packaging technologies for the design and manufacture of electronic products. It will also serve as a refresher for those who wish to expand the breadth of their knowledge and build their network of contacts in the field of electronic packaging.
“The Semiconductor Packaging Workshop” is supported by its hosts the CSA Catapult. It includes facility tours of the Newport Wafer Fab facility, plus a Packaging Surgery, where industry experts will discuss any relevant packaging issues raised by delegates attending the event.
This event is supported by the Compound Semiconductor Applications Catapult
Event brochure ( SPW_Event_Brochure (134 downloads) )
Event presentations will be available to registered attendees. For this you will need to use the ‘Members’ -> ‘Downloads’ menu, then select “The Semiconductor Packaging Workshop 2019 >” to access. Please note that you must be logged in using the same user account as you used to register for the event, otherwise the download link will not be activated..
|9:00||Registration and coffee|
|9:45||Welcome and introductions|
|10:00||Session 1: Package and Substrate Options|
|- Package Selection: Andy Longford, Panda Europe
|- Substrate Options: Steve Riches, Tribus-D|
|11:15||Session 2: Die Preparation, Attach and Interconnection|
|- Die Preparation: Brian Raeburn, Disco Europe
|- Die Attach and Interconnection: Liam Mills, MTC|
|12:15||Tour of Newport Wafer Fab|
|13:15||Lunch and coffee|
|14:00||Session 3: Packaging Clinic|
|Questions and Answers|
|15:15||Session 4: Quality Assessment|
|- Test and Inspection – Nordson Dage
|15:45||Session 5: CSA Catapult - Strategic Packaging|
|- The Compound Semiconductor Applications Catapult (CSAC) -Packaging Facility - Martin McHugh CTO|
|Q & A - then Wrap
Who Should Attend?
Production Operators and Technicians, Research & Development Personnel, Product Designers, Recruitment Personnel, Students, Manufacturing & Technical Engineers, Supply Chain Companies, Process Engineers.
The event is open to all including non IMAPS-UK members, the following delegate rates apply:
IMAPS-UK Member: £185
IMAPS-UK Student Member: £135
Partner member: £195
Non Member: £225
All prices plus VAT and inclusive of free parking, lunch & refreshments.
Local Hotels etc:
Accommodation should be available at a number of local Hotels, including :
- Holiday Inn Express Newport
- Ibis Budget Newport
- St Mellons Hotel Cardiff
- Premier Inn Cardiff East
- Celtic Manor Hotel
- Old Barn Inn
Please note that the entrance for the event will be the Newport Wafer Fab South Gate. located in Duffryn Drive .
For further information, please contact:
Telephone: + 44 (0)131 202 9004
Please note: Payment for tickets to IMAPS-UK events is completed via the PayPal gateway, either as a “Guest” using the “Debit/Credit Card” option, or using an existing PayPal account.
Please add your vehicle registration to the booking form if you are planning to drive to the event
Book Event Tickets
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
This event is fully booked.
Paying by Credit/Debit Card - Click the Pay by Stripe button.
Payment for tickets to IMAPS-UK events is completed via the Stripe gateway
Date(s) - 06/06/2019
9:00 am - 4:30 pm