Wednesday 25 November and Thursday 26 November 2020
Challenges and Solutions for Keeping Electronics Cool
IMAPS-UK will hold an Online Conference on the afternoons of Wednesday 25 November and Thursday 26 November 2020 on the topic of Thermal Management, where you can learn about the latest developments in passive and active cooling, materials, measurement and modelling to address the challenges of enhancing thermal dissipation from advanced electronics systems.
This Online Conference will cover all aspects of designing, manufacturing and testing of high thermal performance electronics, where miniaturisation, costs and reliability are critical features that need to be optimised.
5 key reasons to attend:
- End User Requirements – hear about the challenges facing transportation and industrial applications
- Passive Cooling – overcoming thermal management issues through advanced materials and processes
- Active Cooling – thermoelectric generators, additive manufacturing, embedded cooling
- Measurement and Testing – ensuring long term reliability and fitness for purpose
- Simulation – shortening the design and validation cycle
The Provisional Agenda is presented below (subject to change).
|Wednesday 25 November 2020||Thermal Management and Measurement/Testing|
|13:30||Welcome and Introduction to IMAPS-UK|
|1: Automotive Electric Power Train Challenges||David Bock, BMW|
|2: Advanced Techniques for Semiconductor Package Deformation Measurement: Application to Heterogeneously Integrated Package under Thermal Loading||Ming-Han Wang, ASE|
|3. Materials||Graham Wilson, Indium|
|15:30||4. A thing or two for improving reliability of thermal measurements||Jiyu Wu, NPL|
|5. Thermo-mechanical design and Modelling||Chris Bailey, University of Greenwich|
|17:00||End of Day 1|
|Thursday 26 November 2020||Thermal Management and Design/Modelling/Simulation|
|13:00||Recap of Day 1|
|13:15||6: Thermal Management Challenges for Industrial Motion Control Products||Imran Agha, Siemens|
|7: Active Cooling 1: Thermoelectric Generators||Liam Mills, MTC|
|8: Additive Manufacturing for Cooling Structures||Stephen Mellor, Hieta|
|15:00||9: Overview of the latest heat pipe technology developments for high power density applications||Song Lin, Columbia Staver Ltd|
|10: CFD Modelling for Electronics Cooling – Current Challenges and Emerging Solutions||Robin Bornoff, Mentor Graphics|
|16:30||Closing Remarks and End|
The “Thermal Management – Online” Conference is Free to Attend for the following categories of IMAPS-UK Members (Individual, Corporate, Academic, Student), Members of IMAPS Worldwide and Members of IEEE-EPS. Membership of the above organisations will be checked prior to approval of the booking.
Non-Members of IMAPS (including those only registered on IMAPS-UK website) will be charged a registration fee of £50 (exc VAT).
For further information, please contact IMAPS-UK Office
Book Event Tickets
When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials .
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Date(s) - 25/11/2020 - 26/11/2020
1:00 pm - 5:00 pm
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