Jobs
CSA Catapult – Scholarship for Interns
Scholarship opportunities in Advanced Packaging for 12 month placement for 2022/23. Apply by 10p.m. 20th April 2022.
For more information Click Here
MCS – Project Leader – Material Failure Analysis
MCS are ‘materials forensic scientists’ who have expertise in technical and manufacturing insights using the latest core materials scientific techniques. Working for our client we establish the root cause of a failure and recommend solutions for reliability.
To support our business growth, our partners Solutions Driven are supporting us to find a Project Leader, with a focus on electronics, to manage customer relationships and proactively lead technical investigations.
More information can be found in this Candidate Information Pack.
If you are interested in finding out more, please contact Deborah Simpson by e-mail or phone 07790 578692.
Qualcomm – Senior Semiconductor Packaging Engineer
An exciting opportunity to join Qualcomm world leading centre in Cambridge. You shall be involved in the planning and designs of semiconductor packages such as WLCSP, flip-chip CSP, wire-bond BGA and QFN. Hybrid working available.
Download Job Specification below:
Qualcomm - Senior Semiconductor Packaging Engineer (37 downloads)
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