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Member Directory

Viewing All Profiles. (Showing 1-25 of 31 Results)


Philip Cole

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Scott Wood

Company: Accelonix Ltd

Profile: Accelonix supplies equipment, support and consumables to the electronics and precision machining markets. We provide local specialist skills and knowhow across our four Business Groups; Microelectronics, Metrology, Test & Device Programming and Software Solutions. Benefiting from our own UK applications, demonstration and training centre, we are able to offer our customers access to a wonderful range of state of the art equipment.

Telephone: 01223 659965

Email: sales@accelonix.co.uk

Website: http://www.accelonix.co.uk

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Ralph Green

Company: Airbus

Profile: Airbus is a global leader in aeronautics, space and related services. In 2016, it generated revenues of € 67 billion and employed a workforce of around 134,000. Airbus offers the most comprehensive range of passenger airliners. Airbus is also a European leader providing tanker, combat, transport and mission aircraft, as well as Europe’s number one space enterprise and the world’s second largest space business. In helicopters, provides the most efficient civil and military rotorcraft solutions.

Telephone: +442392704611

Email: ralph.green@airbus.com

Website: https://airbusdefenceandspace.com/

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David King

Company: Alter Technology UK

Profile: Alter UK is a technology-oriented company active in the field of optoelectronics & microelectronics package design and assembly services with a focus on turn-key packaging services that enable its customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments. Alter UK offers full design and assembly of custom Photonic products and is experienced in harsh environment applications, including the Space sector. Alter UK also launched

Telephone: 01506 403550

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Angela Shackcloth

Company: API Microelectronics Ltd

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Oliver Jones

Company: CSA Catapult

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Andy Bonner

Company: Cupio Ltd

Profile: Cupio supplies and supports inspection from the Nordson Test and Inspection Group which includes systems for X-Ray of solder die attach both in-line and stand alone and optical systems for the measurement of die bonds, bone attach underfil and contamination. Cupio also provides failure analysis and inspection services at our facility in Basingstoke.

Telephone: 01256262800

Email: info@cupio.co.uk

Website: http://www.cupio.co.uk

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John Boston

Company: Custom Interconnect Ltd

Profile: Custom Interconnect Limited has one of the largest Chip & Wire facilities within the UK. Housed within two Clean Rooms, CIL's Micro-Electronics facility has an established reputation over 30 years of providing outstanding engineering solutions for its customers. A total of 3 Automatic Die attach machines, using conductive / non-conductive epoxies and Silver Sinter methodologies. Complimenting the die attach are 6 Automatic wire bonders using Gold ball, Aluminium wedge and Gold Wedge with various wire diameters. Areas of expertise are Medical “lab on a chip” packaging, Large area sensors, LED’s, Lasers, ASIC’s, MEMS, SiC, GaN and high power Automotive modules. In addition to the Chip & Wire facilities, CIL has 6 complete SMT lines using both RoHS and non-RoHS solder technologies, 2 x Koh Young 3D AOI, 3 x TAKAYA Flying probe testers, DAGE Quadra5 X-Ray/CT Scan, Auto & Manual BGA/CSP underfill, Selective soldering and Laser Depanelling. Our customers range from Oil & Gas downhole drill bit electronics, Medical, Defence, Aerospace, Automotive, Transportation and various Industrial applications with a full “Box Build” facility for complete product build. Quality accredited to ISO9001, ISO13485 (Medical), AS9100 (Aerospace) and Cyber Essentials, CIL is able to assemble from die through to complete product.

Telephone: 01264 321321

Email: john.boston@cil-uk.co.uk

Website: http://www.cil-uk.co.uk

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Andrew Naisbitt

Company: Gen3 Systems

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Sergei Valev

Company: Honeystone Ltd.

Profile: Production Equipment Sales and Service for Thick Film and Packaging. Exclusive representative of Aurel Automation (screen printers, laser trimmers, multifunction dispenser and microassembly platforms, IR and convection ovens and automation solutions) and Sikama Inc. (compact conduction-convection ovens for wafer bumping, soldering etc.) in the UK. Provider of Turn-Key Solutions for Thick Film Photoimageable Fine Line Technology.

Telephone: +44 (0) 20 7357 7376

Email: sergeiv@honeystone-tec.co.uk

Website: honeystone-tec.co.uk

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Fiona John

Company: ILS2, CNH SWANSEA UNIVERSITY

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Matt Brown

Company: Inseto

Profile: Inseto is a leading technical distributor of equipment and related materials to the microelectronic & advanced technology sectors, as well as adhesives for electronics, automotive & industrial manufacturing.

Telephone: 01264 334505

Email: enquiries@inseto.co.uk

Website: https://www.inseto.co.uk

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Gerald Rutter

Company: IPP

Profile: Industrial Production Processes (IPP) Ltd, formerly APP Ltd, is a technical distributor of manufacturing equipment to the Electronics Industry in the UK and Ireland for over 40 years. Our Electronics Division delivers a range of automated assembly equipment and consumables.

Telephone: 01527 578972

Email: grutter@ippgroupltd.com

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Keith Arber

Company: Leonardo MW

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Mike Petty

Company: Loughborough Surface Analysis Ltd

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Han Jiang

Company: Loughborough University

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Morag Fraser

Company: Material Consultancy Services Ltd

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Simon Osborne

Company: Materion Corporation

Profile: Materion Advanced Materials is an industry leader in providing durable and best-cost solutions for ceramic packages and hermetic covers/lids including Visi-LidTM covers. We also offer braze and solder alloys for the microelectronics industry. Our comprehensive portfolio of packaging materials is available in precious or non-precious material, and we can customize innovative electronic package materials to satisfy your unique needs. Our high-reliability packaging also supports most configurations, applications and volume requirements. Because of our industry expertise, extensive global manufacturing capabilities and R&D proficiency, we are able to meet customers’ packaging requirements today and partner with them to meet future challenges.

Telephone: 44 (0)1488 686056

Email: AdvancedMaterials@Materion.com

Website: http://www.materion.com/advancedmaterials

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Juan Bevan

Company: Micross Components

Profile: Micross is a global provider of semiconductor die/wafer processing, package assembly, test and development solutions for defence, space/aerospace and demanding or harsh environments.

Telephone: 441603788967

Website: http://www.micross.com

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Graham Muir

Company: Plasma-Therm, LLC.

Profile: Plasma-Therm is a global manufacturer of advanced plasma-processing equipment, providing etch, deposition, and plasma dicing technologies used in semiconductor packaging, solid-state lighting, power, data storage, renewable energy, MEMS, nanotechnology, photonics, and wireless communication markets. Plasma-Therm's products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Named the #1 Etch Equipment Supplier in 2019, Plasma-Therm has more than two decades of awards in the VLSIresearch Customer Satisfaction Survey, including the highest score ever earned by a semiconductor equipment company. See http://www.plasmatherm.com .... sales@plasmatherm.com Telephone: +1 (727) 577-4999

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Stephen Pitman

Company: Pyramid Engineering Services Limited

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Andy Berry

Company: Qualcomm Technologies International, Ltd.

Email: aberry@qti.qualcomm.com

Website: http://www.qualcomm.com

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Mark Cracknell

Company: Rakon

Profile: Rakon is a global high technology company that designs and manufactures world leading frequency control solutions. We work mainly in the telecommunications, positioning and space & defence markets. Rakon has six manufacturing plants including three joint venture plants and eight research and development centres. Customer support centres are located in 11 offices worldwide. Head office is based in Auckland, New Zealand.

Telephone: 01279774462

Email: mark.cracknell@rakon.com

Website: http://www.rakon.com

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Heidi Lundén

Company: SCHOTT Primoceler

Profile: SCHOTT Primoceler addresses challenges in hermetic device manufacturing. We help our customers develop, manufacture and test hermetically sealed products. SCHOTT Primoceler offers wafer scale and chip scale bonding to create reliable, fully hermetic glass packages without heat or added materials. Our experience covers for example medical device industry, aerospace and consumer devices.

Telephone: +358 40 505 7623

Email: info@primoceler.com

Website: http://www.schott.com/primoceler

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Carolyn Short

Company: SPTS Technologies Ltd

Profile: SPTS Technologies is a leading supplier of etch and deposition process solutions and equipment for the global semiconductor and microelectronic device manufacturing industries. We provide advanced wafer processing solutions to the world's leading semiconductor device manufacturers and research institutions, and our end-market applications include Advanced Packaging, MEMS, high speed RF IC, power semiconductor devices and LED manufacturing.

Telephone: 01633 414000

Email: enquiries@spts.com

Website: http://www.spts.com

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