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Member Directory

Viewing All Profiles (Showing 1-30 of 31 Results)

Robert Pulman

Profile: ipTEST designs and manufactures a range of high volume, production testers for all types of Discrete Power semiconductors for final product test including wafer test, known good die and packaged back end testing. We are an engineering-based organisation located in Surrey, UK and focus on developing solutions for testing challenging new technologies such as GaN and SiC as well as for the latest generation of MOSFETs, IGBT’s, diodes, SCR’s and bipolars. We invest heavily in R&D and have a dedicated custom engineering team to design unique test systems for custom applications. Our first Mostrak tester was introduced in 1987 and was the world's first indexed parallel test system, offering production throughput increases between 2 and 4 times the output of competitive systems for wafer and back-end. Our latest Mostrak-2 (M2) system provides comprehensive testing for power MOSFETs which sets a new standard for the fastest possible throughput rates. Using test-type specific resources, the M2 family consists of a range of test stations that can be used to perform static parameter tests, transient thermal tests, avalanche energy tests and dynamic switching tests. The individual station’s small footprint gets the tester as close as possible to the device under test so it can operate at the highest possible speeds with the lowest parasitic impedances.

Telephone: 44 1252 740880



Scott Wood

Company: Accelonix Ltd

Profile: Accelonix supplies equipment, support and consumables to the electronics and precision machining markets. We provide local specialist skills and knowhow across our four Business Groups; Microelectronics, Metrology, Test & Device Programming and Software Solutions. Benefiting from our own UK applications, demonstration and training centre, we are able to offer our customers access to a wonderful range of state of the art equipment.

Telephone: 01223 659965



Ralph Green

Company: Airbus

Profile: Airbus is a global leader in aeronautics, space and related services. In 2016, it generated revenues of € 67 billion and employed a workforce of around 134,000. Airbus offers the most comprehensive range of passenger airliners. Airbus is also a European leader providing tanker, combat, transport and mission aircraft, as well as Europe’s number one space enterprise and the world’s second largest space business. In helicopters, provides the most efficient civil and military rotorcraft solutions.

Telephone: +442392704611



David King

Company: Alter Technology UK

Profile: Alter UK is a technology-oriented company active in the field of optoelectronics & microelectronics package design and assembly services with a focus on turn-key packaging services that enable its customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments. Alter UK offers full design and assembly of custom Photonic products and is experienced in harsh environment applications, including the Space sector. Alter UK also launched

Telephone: 01506 403550

Andrew Robertson

Company: Bay Photonics

Venothan Naidoo

Company: Carl Zeiss Ltd

Profile: ZEISS is an internationally leading technology company operating in the fields of optics and optoelectronics. ZEISS has the most comprehensive portfolio of light, X-ray, electron and ion beam microscope systems in the industry and is a leading solution provider to the global semiconductor community. Solutions span semiconductor manufacturing from wafer fab through packaging and assembly. ZEISS materials characterisation and non-destructive failure analysis solutions deliver actionable information to both wafer fab and packaging/assembly processes to meet the semiconductor industry’s challenges for next-generation devices. With a portfolio aligned with future growth in the electronics and semiconductor industry, ZEISS is shaping the future of technology and constantly advancing the world of optics and related fields with its solutions. The company's significant, sustainable investments in research and development lay the foundation for the success and continued expansion of ZEISS' technology and market leadership. ZEISS is active globally in almost 50 countries with around 30 production sites, 60 sales and service companies and 27 R&D facilities. Founded in 1846 in Jena, the company is headquartered in Oberkochen, Germany. The Carl Zeiss Foundation, one of the largest foundations in Germany committed to the promotion of science, is the sole owner of the holding company, Carl Zeiss AG.

Telephone: 44 (0) 1223 401 500



Fiona John


Andy Bonner

Company: Cupio Ltd

Profile: Cupio supplies and supports inspection from the Nordson Test and Inspection Group which includes systems for X-Ray of solder die attach both in-line and stand alone and optical systems for the measurement of die bonds, bone attach underfil and contamination. Cupio also provides failure analysis and inspection services at our facility in Basingstoke.

Telephone: 01256262800



John Boston

Company: Custom Interconnect Ltd

Profile: Custom Interconnect Limited has one of the largest Chip & Wire facilities within the UK. Housed within two Clean Rooms, CIL's Micro-Electronics facility has an established reputation over 30 years of providing outstanding engineering solutions for its customers. A total of 3 Automatic Die attach machines, using conductive / non-conductive epoxies and Silver Sinter methodologies. Complimenting the die attach are 6 Automatic wire bonders using Gold ball, Aluminium wedge and Gold Wedge with various wire diameters. Areas of expertise are Medical “lab on a chip” packaging, Large area sensors, LED’s, Lasers, ASIC’s, MEMS, SiC, GaN and high power Automotive modules. In addition to the Chip & Wire facilities, CIL has 6 complete SMT lines using both RoHS and non-RoHS solder technologies, 2 x Koh Young 3D AOI, 3 x TAKAYA Flying probe testers, DAGE Quadra5 X-Ray/CT Scan, Auto & Manual BGA/CSP underfill, Selective soldering and Laser Depanelling. Our customers range from Oil & Gas downhole drill bit electronics, Medical, Defence, Aerospace, Automotive, Transportation and various Industrial applications with a full “Box Build” facility for complete product build. Quality accredited to ISO9001, ISO13485 (Medical), AS9100 (Aerospace) and Cyber Essentials, CIL is able to assemble from die through to complete product.

Telephone: 01264 321321



Mark Addlesee

Company: Dynex Semiconductors Ltd

Profile: Dynex Semiconductor Ltd has a rich history in the design, development and production of low and high power IGBT modules, Bipolar capsule devices and power assemblies. Throughout the years, Dynex products have been applied in projects that vary from transportation, power grid, renewables, industrial, equipment and specialist applications for customers in Europe, US and the rapidly growing Far Eastern markets. From initial concept and design to production, Dynex can support customer requirements to provide enhanced, reliable device outlines customised for individual application requirements, including those in the electric vehicle, power grid, renewable energy, traction and industrial markets. Dynex products can be designed to industry standard or refined with the option of bespoke connectivity and/or circuit topology and/or heatsinks-water cooled/air-cooled/ phase change or double side. To ensure consistency of product performance and quality, manufacturing is carried out under strictly controlled clean room conditions.

Telephone: 01522 500 500



Fin Farrelly

Company: Filtronic

Chris Hunt

Company: Gen3 Systems

Profile: Gen3, a specialist manufacturer of award-winning test and measurement equipment used to improve electronic circuit reliability. We manufacture equipment for high voltage insulation resistance measurements, such as SIR and CAF. The equipment multiplexes across 256 channels every minute, can measure to 1012Ω, and measure up to 1250V. Gen3 designs and manufactures conformal coating process equipment - bench-top and in-line systems - and offers a range of test services. Gen3 also distributes equipment manufactured by some of the World’s leading specialists; MEK Europe, Nordson SELECT, Finetech and MBTech. Product Profile: Conformal Coatings, Electronic Production, Measuring Services/Inspection, Process Control, Quality Control, Reliability/Failure Analysis, Testing Services, Consultancy

Telephone: +441252521500



Sergei Valev

Company: Honeystone Ltd.

Profile: Production Equipment Sales and Service for Thick Film and Packaging. Exclusive representative of Aurel Automation (screen printers, laser trimmers, multifunction dispenser and microassembly platforms, IR and convection ovens and automation solutions) and Sikama Inc. (compact conduction-convection ovens for wafer bumping, soldering etc.) in the UK. Provider of Turn-Key Solutions for Thick Film Photoimageable Fine Line Technology.

Telephone: +44 (0) 20 7357 7376




Company: Industrial production processes (Ipp)

Profile: With over 40 years’ experience, IPP (formerly APP Ltd in the UK and IPT Ltd trading as IPP in Ireland) is a technical distributor of manufacturing equipment to the electronics, pharmaceutical and medical device sectors across the UK and Ireland.

Telephone: 07834540089



Eamonn Redmond

Company: Inseto (UK) Ltd

Profile: Inseto provides manufacturing equipment, plus assembly materials and adhesives for microelectronic research & production. Products include: vacuum reflow systems, plasma cleaners/etchers, probers, dicing & scribing systems, die sort and bonders, wire bonders, pull/shear test equipment, in addition to complementary machine consumables and materials.

Telephone: +441264334505



Carolyn Short

Company: KLA Corporation

Profile: The SPTS Division of KLA is a leading supplier of etch and deposition process solutions and equipment for the global semiconductor and microelectronic device manufacturing industries. We provide advanced wafer processing solutions to the world's leading semiconductor device manufacturers and research institutions, and our end-market applications include Advanced Packaging, MEMS, high speed RF IC, photonics and power semiconductor device manufacturing.

Telephone: 01633 414000



Mike Petty

Company: Loughborough Surface Analysis Ltd

Profile: Loughborough Surface Analysis Ltd is a long established laboratory specialising in surface analysis. The company provides specialist contract surface analysis services to both industry and academic sectors. The techniques we provide include: Secondary Ion Mass Spectrometry (SIMS), Scanning Electron Microscopy with Energy Dispersive X-Ray detection (SEM-EDX), Auger Electron Spectroscopy (AES), X-Ray Photoelectron Spectroscopy (XPS) and Focussed Ion Beam Sectioning (FIB). These techniques can be used to investigate many electronic packaging issues.

Telephone: 44 (0) 1509 260 779



Changqing Liu

Company: Loughborough University

Simon Osborne

Company: Materion Corporation

Profile: Materion Advanced Materials is an industry leader in providing durable and best-cost solutions for ceramic packages and hermetic covers/lids including Visi-LidTM covers. We also offer braze and solder alloys for the microelectronics industry. Our comprehensive portfolio of packaging materials is available in precious or non-precious material, and we can customize innovative electronic package materials to satisfy your unique needs. Our high-reliability packaging also supports most configurations, applications and volume requirements. Because of our industry expertise, extensive global manufacturing capabilities and R&D proficiency, we are able to meet customers’ packaging requirements today and partner with them to meet future challenges.

Telephone: 44 (0)7887755504



Suzanne Costello

Company: MCS Ltd

Madi Neve

Company: Micross

Martin Wickham

Company: National Physical Laboratory

Christopher Davies

Company: Nordson Test & Inspection

Alexandre Prevost

Company: Pyramid Engineering Services

Profile: Pyramid Engineering Services are positioned as a market leader within the Global Semiconductor Industry for the design and manufacture of Gloveboxes, Ovens, Welding Systems and Ancillary Equipment for controlled atmosphere package encapsulation. We offer bespoke system solutions to meet customer specifications and are able to design to all levels of automation. We offer a range of Package Sealing Systems including Laser, Projection, Resistance and Cold Welding within controlled environment enclosures for customers requiring manual or automatic assembly.

Telephone: 0208 3209590



Andy Berry

Company: Qualcomm Technologies International, Ltd.



Malkit Jhitta

Company: RoodMicrotec

Profile: RoodMicrotec is a leading independent company for semiconductor supply and quality services. With over 5O years of experience in the semiconductor and electronics industry, RoodMicrotec is well established as a highly valued partner for many companies worldwide. The company provides full-turnkey services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of semiconductor ICs in any volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automo¬tive, healthcare and industrial sectors. RoodMicrotec's headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany and a Sales Office in the UK. Value-added services include: • Supply Chain Management • Qualification & Reliability investigations • Wafer & Component Testing • Failure & Technology Analysis Our quality management system is certified according to ISO 9001 and VDA6.2. The laboratories in Nördlingen and Stuttgart are accredited according to DIN ISO/IEC 17025:2005 by the German accreditation body DAkkS.



Heidi Lundén

Company: Schott Primoceler Oy

Profile: SCHOTT Primoceler addresses challenges in hermetic device manufacturing. We help our customers develop, manufacture and test hermetically sealed products. SCHOTT Primoceler offers wafer scale and chip scale bonding to create reliable, fully hermetic glass packages without heat or added materials. Our experience covers for example medical device industry, aerospace and consumer devices.

Telephone: +358 40 505 7623



Brian Basford

Company: Technograph Microcircuits

Profile: Micro-electronic solutions for demanding applications. Using a combination of expertise, heritage & state-of-the-art design tools we successfully realise advanced electronics solutions destined for harsh and demanding operating environments. From the vast heights of space to the deepest depths of oil wells.

Telephone: 02392321654



John Lipp

Company: UKRI - Science and Technology Facilities Council

Profile: STFC Interconnect provides assembly, wire-bonding and fine-pitch flip-chip bonding in support of STFC's science programmes. Our advanced interconnect development programme gains access to next generation interconnect technologies in readiness for when our science programmes require them.

Telephone: +44 1235 445316


Peter Gammon

Company: University of Warwick

Profile: The Electrical Power Research Group at Warwick University is set up to conduct internationally leading research and drive for cutting edge technology development in tackling the great challenges in power generation, energy conversion, distribution, transmission and efficient use of energy. Our research is supported by state-of-the-art research facilities in three research laboratories: Power Electronics, Applications and Technology in Energy Research (PEATER) Laboratory, Power and Control Systems Research laboratory and Power Electronics Applications Lab. The group’s expertise covers power electronic devices (SiC, fabrications, packaging, reliability, modelling and simulation), power electronics applications, drives and control, power system modelling and control, compressed air energy storage, wind power generation, HVDC, hardware-in-the-loop modelling, simulation and control.

Telephone: +44 (0)24 765 23154