Viewing All Profiles (Showing 1-25 of 38 Results)
Company: Accelonix Ltd
Profile: Accelonix supplies equipment, support and consumables to the electronics and precision machining markets. We provide local specialist skills and knowhow across our four Business Groups; Microelectronics, Metrology, Test & Device Programming and Software Solutions. Benefiting from our own UK applications, demonstration and training centre, we are able to offer our customers access to a wonderful range of state of the art equipment.
Telephone: 01223 659965
Profile: Airbus is a global leader in aeronautics, space and related services. In 2016, it generated revenues of € 67 billion and employed a workforce of around 134,000. Airbus offers the most comprehensive range of passenger airliners. Airbus is also a European leader providing tanker, combat, transport and mission aircraft, as well as Europe’s number one space enterprise and the world’s second largest space business. In helicopters, provides the most efficient civil and military rotorcraft solutions.
Company: Alter Technology UK
Profile: Alter UK is a technology-oriented company active in the field of optoelectronics & microelectronics package design and assembly services with a focus on turn-key packaging services that enable its customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments. Alter UK offers full design and assembly of custom Photonic products and is experienced in harsh environment applications, including the Space sector. Alter UK also launched
Telephone: 01506 403550
Company: Carl Zeiss Ltd
Profile: ZEISS is an internationally leading technology company operating in the fields of optics and optoelectronics. ZEISS has the most comprehensive portfolio of light, X-ray, electron and ion beam microscope systems in the industry and is a leading solution provider to the global semiconductor community. Solutions span semiconductor manufacturing from wafer fab through packaging and assembly. ZEISS materials characterisation and non-destructive failure analysis solutions deliver actionable information to both wafer fab and packaging/assembly processes to meet the semiconductor industry’s challenges for next-generation devices. With a portfolio aligned with future growth in the electronics and semiconductor industry, ZEISS is shaping the future of technology and constantly advancing the world of optics and related fields with its solutions. The company's significant, sustainable investments in research and development lay the foundation for the success and continued expansion of ZEISS' technology and market leadership. ZEISS is active globally in almost 50 countries with around 30 production sites, 60 sales and service companies and 27 R&D facilities. Founded in 1846 in Jena, the company is headquartered in Oberkochen, Germany. The Carl Zeiss Foundation, one of the largest foundations in Germany committed to the promotion of science, is the sole owner of the holding company, Carl Zeiss AG.
Telephone: 44 (0) 1223 401 500
Company: Cupio Ltd
Profile: Cupio supplies and supports inspection from the Nordson Test and Inspection Group which includes systems for X-Ray of solder die attach both in-line and stand alone and optical systems for the measurement of die bonds, bone attach underfil and contamination. Cupio also provides failure analysis and inspection services at our facility in Basingstoke.
Company: Custom Interconnect Ltd
Profile: Custom Interconnect Limited has one of the largest Chip & Wire facilities within the UK. Housed within two Clean Rooms, CIL's Micro-Electronics facility has an established reputation over 30 years of providing outstanding engineering solutions for its customers. A total of 3 Automatic Die attach machines, using conductive / non-conductive epoxies and Silver Sinter methodologies. Complimenting the die attach are 6 Automatic wire bonders using Gold ball, Aluminium wedge and Gold Wedge with various wire diameters. Areas of expertise are Medical “lab on a chip” packaging, Large area sensors, LED’s, Lasers, ASIC’s, MEMS, SiC, GaN and high power Automotive modules. In addition to the Chip & Wire facilities, CIL has 6 complete SMT lines using both RoHS and non-RoHS solder technologies, 2 x Koh Young 3D AOI, 3 x TAKAYA Flying probe testers, DAGE Quadra5 X-Ray/CT Scan, Auto & Manual BGA/CSP underfill, Selective soldering and Laser Depanelling. Our customers range from Oil & Gas downhole drill bit electronics, Medical, Defence, Aerospace, Automotive, Transportation and various Industrial applications with a full “Box Build” facility for complete product build. Quality accredited to ISO9001, ISO13485 (Medical), AS9100 (Aerospace) and Cyber Essentials, CIL is able to assemble from die through to complete product.
Telephone: 01264 321321
Company: Dynex Semiconductors Ltd
Profile: Dynex Semiconductor Ltd has a rich history in the design, development and production of low and high power IGBT modules, Bipolar capsule devices and power assemblies. Throughout the years, Dynex products have been applied in projects that vary from transportation, power grid, renewables, industrial, equipment and specialist applications for customers in Europe, US and the rapidly growing Far Eastern markets. From initial concept and design to production, Dynex can support customer requirements to provide enhanced, reliable device outlines customised for individual application requirements, including those in the electric vehicle, power grid, renewable energy, traction and industrial markets. Dynex products can be designed to industry standard or refined with the option of bespoke connectivity and/or circuit topology and/or heatsinks-water cooled/air-cooled/ phase change or double side. To ensure consistency of product performance and quality, manufacturing is carried out under strictly controlled clean room conditions.
Telephone: 01522 500 500
Company: Filtronic Broadband Limited
Profile: Filtronic designs and manufactures products that transmit, receive, condition and manage radio waves, particularly at microwave and mmWave. Its components and integrated systems are used in mission-critical communications networks worldwide. Their knowledge and ingenuity enable solutions for highly complex RF challenges. These can be applied in a range of markets, including mobile telecommunications infrastructure, defence and aerospace, and emergency first-responder communications.
Telephone: 01740 618 821
Company: Gen3 Ltd
Company: Heraeus Electronics
Profile: Heraeus Electronics – a Global Business Unit of the Heraeus Group – is a leading supplier of material solutions for the Electronics Packaging and Component Industry in Power Electronics, Advanced Semiconductor Packaging and Automotive Electronics. Core competences include bonding wires, assembly materials, thick film pastes, substrates, and their integration into perfectly matched systems.
Telephone: +44(0)7831 315456
Company: Honeystone Ltd.
Profile: Production Equipment Sales and Service for Thick Film and Packaging. Exclusive representative of Aurel Automation (screen printers, laser trimmers, multifunction dispenser and microassembly platforms, IR and convection ovens and automation solutions) and Sikama Inc. (compact conduction-convection ovens for wafer bumping, soldering etc.) in the UK. Provider of Turn-Key Solutions for Thick Film Photoimageable Fine Line Technology.
Telephone: +44 (0) 20 7357 7376
Company: ILS2, CNH SWANSEA UNIVERSITY
Company: Industrial production processes (Ipp)
Profile: With over 40 years’ experience, IPP (formerly APP Ltd in the UK and IPT Ltd trading as IPP in Ireland) is a technical distributor of manufacturing equipment to the electronics, pharmaceutical and medical device sectors across the UK and Ireland.
Profile: Inseto is a leading technical distributor of equipment and related materials to the microelectronic & advanced technology sectors, as well as adhesives for electronics, automotive & industrial manufacturing.
Telephone: 01264 334505
Company: Loughborough Surface Analysis Ltd
Profile: Loughborough Surface Analysis Ltd is a long established laboratory specialising in surface analysis. The company provides specialist contract surface analysis services to both industry and academic sectors. The techniques we provide include: Secondary Ion Mass Spectrometry (SIMS), Scanning Electron Microscopy with Energy Dispersive X-Ray detection (SEM-EDX), Auger Electron Spectroscopy (AES), X-Ray Photoelectron Spectroscopy (XPS) and Focussed Ion Beam Sectioning (FIB). These techniques can be used to investigate many electronic packaging issues.
Telephone: 44 (0) 1509 260 779
Company: Loughborough University
Profile: The Electronics Manufacturing Research Group at Loughborough University addresses the challenges in the design, integration, materials and manufacture of electronics intensive products, applicable across multiple industrial sectors including telecom, transport, energy, healthcare/bio-medical, IoTs/wearable electronics and space/aerospace. Aligned closely with potential industrial applications concerning the development of novel Advanced Interconnect Materials (AIMs), the group conducts the underpinning research into 3D heterogeneous embodiment, integration and miniaturisation of future generation complex multifunctional devices. In order to fulfil the material microstructural stability and functional robustness, a wide range of manufacturing routes are being developed, including; novel soldering, sintering or bonding with micro- and nano-particles, pastes and preformed thin films, electrochemical process, selective, additive and subtractive processes.
Telephone: 44 (0) 1509 227 681
Company: Materion Corporation
Profile: Materion Advanced Materials is an industry leader in providing durable and best-cost solutions for ceramic packages and hermetic covers/lids including Visi-LidTM covers. We also offer braze and solder alloys for the microelectronics industry. Our comprehensive portfolio of packaging materials is available in precious or non-precious material, and we can customize innovative electronic package materials to satisfy your unique needs. Our high-reliability packaging also supports most configurations, applications and volume requirements. Because of our industry expertise, extensive global manufacturing capabilities and R&D proficiency, we are able to meet customers’ packaging requirements today and partner with them to meet future challenges.
Telephone: 44 (0)1488 686056
Company: MCS Ltd
Company: Micross Components
Profile: Ultra CEMS – Microelectronics, is a dynamic organisation providing engineering and manufacturing services for both harsh and high temperature applications in high reliability, safety critical applications. Ultra, founded over 33 years ago, has an extensive toolbox of microelectronic assembly technologies with specific expertise in the Multichip Hybrid Module market (aka thin and thick film hybrids). Ultra is highly experienced in solving customers’ design and manufacturing problems. Our markets include defence, medical, space, aerospace, oil & gas and industrial. In addition, any electronics needing miniaturisation or designs needing obsolescence mitigation for extended serviceable life, we can also help both design and manufacture. Supported by accreditations such as thick film hybrid (BS9450) and aerospace and defence (AS9100-D), Ultra is well positioned to service these markets. Ultra has an experienced and flexible electronic design and process engineering team, being able to offer not only hybridisation, but also design assistance, e.g. taking existing designs using conventional packaged components and redesigning (if necessary) to use hybrid electronics. Further our sister site in Weymouth can help with conventional PCB assembly work. With experience in flip chip, resistor printing, excellent supply chain channels, full electrical and environmental testing, ISO 4 (Class 10) clean room facilities, 3D electronic designs (eg using flex PCB), Ultra can service most design and manufacturing requirements. Anything further, the rest of the Ultra Group could help support.
Telephone: +44 (0)2392 382 222
Company: Micross Components
Profile: Micross is a global provider of semiconductor die/wafer processing, package assembly, test and development solutions for defence, space/aerospace and demanding or harsh environments.
Company: MSC Software
Profile: MSC Software: At Hexagon we are dedicated to bringing the virtual and physical worlds together to enable our customers to drive their ideas forward and stay ahead. Nowhere is this more important than in the design and manufacture of industrial and consumer electronics. Come and talk to us about: • Your electronic thermal, thermo-structural & fatigue performance challenges • Our micro scale scanning and computed tomography capabilities • Material behaviour modelling solutions • Materials, simulation and sustainability management tools • Your problems!
Telephone: T: +44(0) 1276 905041
Company: MTC Limited
Company: Murata Power Solutions
Company: Nordson DAGE
Profile: Dage was founded in 1961 and is a market leader in its chosen markets of Semiconductor and PCBA Manufacture. It has an award winning portfolio of Bondtester and X-ray Inspection Systems for destructive and non-destructive mechanical testing and inspection of electronic components.
Telephone: +44 1296 317828