Member Directory
Viewing All Profiles. (Showing 1-25 of 31 Results)
Company: Accelonix Ltd
Profile: Accelonix supplies equipment, support and consumables to the electronics and precision machining markets. We provide local specialist skills and knowhow across our four Business Groups; Microelectronics, Metrology, Test & Device Programming and Software Solutions. Benefiting from our own UK applications, demonstration and training centre, we are able to offer our customers access to a wonderful range of state of the art equipment.
Telephone: 01223 659965
Email: sales@accelonix.co.uk
Website: http://www.accelonix.co.uk
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Company: Airbus
Profile: Airbus is a global leader in aeronautics, space and related services. In 2016, it generated revenues of € 67 billion and employed a workforce of around 134,000. Airbus offers the most comprehensive range of passenger airliners. Airbus is also a European leader providing tanker, combat, transport and mission aircraft, as well as Europe’s number one space enterprise and the world’s second largest space business. In helicopters, provides the most efficient civil and military rotorcraft solutions.
Telephone: +442392704611
Email: ralph.green@airbus.com
Website: https://airbusdefenceandspace.com/
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Company: API Technologies Microelectronics ltd
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Company: Centre for NanoHealth - Swansea University
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Company: CSA Catapult
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Company: Cupio Ltd
Profile: Cupio supplies and supports inspection from the Nordson Test and Inspection Group which includes systems for X-Ray of solder die attach both in-line and stand alone and optical systems for the measurement of die bonds, bone attach underfil and contamination.
Telephone: +441962832654
Email: info@cupio.co.uk
Website: http://www.cupio.co.uk
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Company: Custom Interconnect Ltd
Profile: Custom Interconnect Limited has one of the largest independent “Chip & Wire” facility within the UK. Housed within two Clean Rooms, CIL's Advanced Technology Group has an established reputation for providing outstanding engineering solutions. •Die bonding using conductive or non conductive epoxies and eutectic soldering •Aluminium wedge, Gold wedge & Gold ball bonding utilizing advanced automated equipment All assembly is performed in the UK, to guarantee customer Intellectual property.
Telephone: 01264 321321
Email: john.boston@cil-uk.co.uk
Website: http://www.cil-uk.co.uk
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Company: Gen3 Systems
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Company: Hermetic Solutions Group
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Company: Honeystone Ltd.
Profile: Production Equipment Sales and Service for Thick Film and Packaging. Exclusive representative of Aurel Automation (screen printers, laser trimmers, multifunction dispenser and microassembly platforms, IR and convection ovens and automation solutions) and Sikama Inc. (compact conduction-convection ovens for wafer bumping, soldering etc.) in the UK. Provider of Turn-Key Solutions for Thick Film Photoimageable Fine Line Technology.
Telephone: +44 (0) 20 7357 7376
Email: sergeiv@honeystone-tec.co.uk
Website: honeystone-tec.co.uk
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Company: Imperial College London
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Company: InfraRed Integrated Systems Limited
Profile: Irisys is the world’s leading supplier of People Counting sensors, with a heritage spanning 20 years of world class innovation. With unique thermal based technology, our sensors and powerful counting algorithms are used all over the world by organisations spanning retail, supermarkets, transport hubs, corporate offices, universities, and more.
Telephone: 01606 595455
Email: jon.hall@irisys.co.uk
Website: http://www.irisys.net
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Company: Inseto
Profile: Inseto is a leading technical distributor of equipment and related materials to the microelectronic & advanced technology sectors, as well as adhesives for electronics, automotive & industrial manufacturing.
Telephone: 01264 334505
Email: enquiries@inseto.co.uk
Website: https://www.inseto.co.uk
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Company: Leonardo MW
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Company: Loughborough Surface Analysis Ltd
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Company: Micross Components
Profile: Micross is a global provider of semiconductor die/wafer processing, package assembly, test and development solutions for defence, space/aerospace and demanding or harsh environments.
Telephone: 441603788967
Website: http://www.micross.com
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Company: Nordson Dage
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Company: Optim Wafer Services
Profile: Optim Wafer Services offers, high quality, reliable, value for money wafer processing services such as wafer thinning, edge trimming, polishing, dicing, dice before grind, Taiko, pick and place services, bonding, wafer reclaim, wafer supply & process development. We are dynamic and flexible to our customer's requirements and take the time to really understand your needs to provide exactly what is specified. We are located in the south of France in the Rousset area.
Telephone: +33 442 126 150
Email: enquiries@optimwaferservices.com
Website: http://www.optimwaferservice.com
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Company: Optocap Ltd
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Company: Oxford University
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Company: Pyramid Engineering Services Limited
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Company: Qualcomm Technologies International, Ltd.
Email: aberry@qti.qualcomm.com
Website: http://www.qualcomm.com
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Company: Rakon
Profile: Rakon is a global high technology company that designs and manufactures world leading frequency control solutions. We work mainly in the telecommunications, positioning and space & defence markets. Rakon has six manufacturing plants including three joint venture plants and eight research and development centres. Customer support centres are located in 11 offices worldwide. Head office is based in Auckland, New Zealand.
Telephone: 01279774462
Email: mark.cracknell@rakon.com
Website: http://www.rakon.com
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Company: SCHOTT Primoceler
Profile: SCHOTT Primoceler addresses challenges in hermetic device manufacturing. We help our customers develop, manufacture and test hermetically sealed products. SCHOTT Primoceler offers wafer scale and chip scale bonding to create reliable, fully hermetic glass packages without heat or added materials. Our experience covers for example medical device industry, aerospace and consumer devices.
Telephone: +358 40 505 7623
Email: info@primoceler.com
Website: http://www.schott.com/primoceler
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Company: Science and Technology Facilities Council
Profile: STFC Interconnect provides assembly, wire-bonding and fine-pitch flip-chip bonding in support of STFC's science programmes. Our advanced interconnect development programme gains access to next generation interconnect technologies in readiness for when our science programmes require them.
Telephone: +44 1235 445316
Website: http://www.stfc.ac.uk
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