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Member Directory

Viewing All Profiles (Showing 1-29 of 29 Results)


Simon Osborne

Telephone: 44 (0)7887755504

Email: ossyoss1@outlook.com


Scott Wood

Company: Accelonix Ltd

Profile: Accelonix supplies equipment, support and consumables to the electronics and precision machining markets. We provide local specialist skills and knowhow across our four Business Groups; Microelectronics, Metrology, Test & Device Programming and Software Solutions. Benefiting from our own UK applications, demonstration and training centre, we are able to offer our customers access to a wonderful range of state of the art equipment.

Telephone: 01223 659965

Email: sales@accelonix.co.uk

Website: http://www.accelonix.co.uk


David King

Company: Alter Technology UK

Profile: Alter UK is a technology-oriented company active in the field of optoelectronics & microelectronics package design and assembly services with a focus on turn-key packaging services that enable its customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments. Alter UK offers full design and assembly of custom Photonic products and is experienced in harsh environment applications, including the Space sector. Alter UK also launched

Telephone: 01506 403550


Glenn George

Company: Bay Photonics


Andrew Robertson

Company: Bay Photonics


Venothan Naidoo

Company: Carl Zeiss Ltd

Profile: ZEISS is an internationally leading technology company operating in the fields of optics and optoelectronics. ZEISS has the most comprehensive portfolio of light, X-ray, electron and ion beam microscope systems in the industry and is a leading solution provider to the global semiconductor community. Solutions span semiconductor manufacturing from wafer fab through packaging and assembly. ZEISS materials characterisation and non-destructive failure analysis solutions deliver actionable information to both wafer fab and packaging/assembly processes to meet the semiconductor industry’s challenges for next-generation devices. With a portfolio aligned with future growth in the electronics and semiconductor industry, ZEISS is shaping the future of technology and constantly advancing the world of optics and related fields with its solutions. The company's significant, sustainable investments in research and development lay the foundation for the success and continued expansion of ZEISS' technology and market leadership. ZEISS is active globally in almost 50 countries with around 30 production sites, 60 sales and service companies and 27 R&D facilities. Founded in 1846 in Jena, the company is headquartered in Oberkochen, Germany. The Carl Zeiss Foundation, one of the largest foundations in Germany committed to the promotion of science, is the sole owner of the holding company, Carl Zeiss AG.

Telephone: 44 (0) 1223 401 500

Email: veno.naidoo@zeiss.com

Website: http://www.zeiss.co.uk


Fiona John

Company: CISM - SWANSEA UNIVERSITY


John Boston

Company: Custom Interconnect Ltd

Profile: C has one of the largest Chip & Wire facilities within the UK. Housed within two Clean Rooms, CIL's Micro-Electronics facility has an established reputation over 30 years of providing outstanding engineering solutions for its customers. A total of 3 Automatic Die attach machines, using conductive / non-conductive epoxies and Silver Sinter methodologies. Complimenting the die attach are 6 Automatic wire bonders using Gold ball, Aluminium wedge and Gold Wedge with various wire diameters. Areas of expertise are Medical “lab on a chip” packaging, Large area sensors, LED’s, Lasers, ASIC’s, MEMS, SiC, GaN and high power Automotive modules. In addition to the Chip & Wire facilities, CIL has 6 complete SMT lines using both RoHS and non-RoHS solder technologies, 2 x Koh Young 3D AOI, 3 x TAKAYA Flying probe testers, DAGE Quadra5 X-Ray/CT Scan, Auto & Manual BGA/CSP underfill, Selective soldering and Laser Depanelling. Our customers range from Oil & Gas downhole drill bit electronics, Medical, Defence, Aerospace, Automotive, Transportation and various Industrial applications with a full “Box Build” facility for complete product build. Quality accredited to ISO9001, ISO13485 (Medical), AS9100 (Aerospace) and Cyber Essentials, CIL is able to assemble from die through to complete product.

Telephone: 01264 321321

Email: john.boston@cil-uk.co.uk

Website: http://www.cil-uk.co.uk


Mark Addlesee

Company: Dynex Semiconductors Ltd

Profile: Dynex Semiconductor Ltd has a rich history in the design, development and production of low and high power IGBT modules, Bipolar capsule devices and power assemblies. Throughout the years, Dynex products have been applied in projects that vary from transportation, power grid, renewables, industrial, equipment and specialist applications for customers in Europe, US and the rapidly growing Far Eastern markets. From initial concept and design to production, Dynex can support customer requirements to provide enhanced, reliable device outlines customised for individual application requirements, including those in the electric vehicle, power grid, renewable energy, traction and industrial markets. Dynex products can be designed to industry standard or refined with the option of bespoke connectivity and/or circuit topology and/or heatsinks-water cooled/air-cooled/ phase change or double side. To ensure consistency of product performance and quality, manufacturing is carried out under strictly controlled clean room conditions.

Telephone: 01522 500 500

Email: powersolutions@dynexsemi.com

Website: http://www.dynexsemi.com


Fin Farrelly

Company: Filtronic


Chris Hunt

Company: Gen3 Systems

Profile: Gen3, a specialist manufacturer of award-winning test and measurement equipment used to improve electronic circuit reliability. We manufacture equipment for high voltage insulation resistance measurements, such as SIR and CAF. The equipment multiplexes across 256 channels every minute, can measure to 1012Ω, and measure up to 1250V. Gen3 designs and manufactures conformal coating process equipment - bench-top and in-line systems - and offers a range of test services. Gen3 also distributes equipment manufactured by some of the World’s leading specialists; MEK Europe, Nordson SELECT, Finetech and MBTech. Product Profile: Conformal Coatings, Electronic Production, Measuring Services/Inspection, Process Control, Quality Control, Reliability/Failure Analysis, Testing Services, Consultancy

Telephone: +441252521500

Email: sales@gen3systems.com

Website: http://www.gen3systems.com


Sergei Valev

Company: Honeystone Ltd.

Profile: Production Equipment Sales and Service for Thick Film and Packaging. Exclusive representative of Aurel Automation (screen printers, laser trimmers, multifunction dispenser and microassembly platforms, IR and convection ovens and automation solutions) and Sikama Inc. (compact conduction-convection ovens for wafer bumping, soldering etc.) in the UK. Provider of Turn-Key Solutions for Thick Film Photoimageable Fine Line Technology.

Telephone: +44 (0) 20 7357 7376

Email: sergeiv@honeystone-tec.co.uk

Website: honeystone-tec.co.uk


GERALD RUTTER

Company: Industrial production processes (Ipp)

Profile: With over 40 years’ experience, IPP (formerly APP Ltd in the UK and IPT Ltd trading as IPP in Ireland) is a technical distributor of manufacturing equipment to the electronics, pharmaceutical and medical device sectors across the UK and Ireland.

Telephone: 07834540089

Email: GRUTTER@IPPGROUPLTD.COM

Website: ippgroupltd.com


Eamonn Redmond

Company: Inseto (UK) Ltd

Profile: Inseto provides manufacturing equipment, plus assembly materials and adhesives for microelectronic research & production. Products include: vacuum reflow systems, plasma cleaners/etchers, probers, dicing & scribing systems, die sort and bonders, wire bonders, pull/shear test equipment, in addition to complementary machine consumables and materials.

Telephone: +441264334505

Email: enquiries@inseto.co.uk

Website: http://www.inseto.co.uk


Carolyn Short

Company: KLA Corporation (SPTS Division)

Profile: The SPTS Division of KLA is a leading supplier of etch and deposition process solutions and equipment for the global semiconductor and microelectronic device manufacturing industries. We provide advanced wafer processing solutions to the world's leading semiconductor device manufacturers and research institutions, and our end-market applications include Advanced Packaging, MEMS, high speed RF IC, photonics and power semiconductor device manufacturing.

Telephone: 01633 414000

Email: enquiries@spts.com

Website: http://www.spts.com


Mike Petty

Company: Loughborough Surface Analysis Ltd

Profile: Loughborough Surface Analysis Ltd is a long established laboratory specialising in surface analysis. The company provides specialist contract surface analysis services to both industry and academic sectors. The techniques we provide include: Secondary Ion Mass Spectrometry (SIMS), Scanning Electron Microscopy with Energy Dispersive X-Ray detection (SEM-EDX), Auger Electron Spectroscopy (AES), X-Ray Photoelectron Spectroscopy (XPS) and Focussed Ion Beam Sectioning (FIB). These techniques can be used to investigate many electronic packaging issues.

Telephone: 44 (0) 1509 260 779

Email: m.petty@LSALtd.co.uk

Website: http://www.LSALtd.co.uk


Madi Neve

Company: Micross


Martin Wickham

Company: National Physical Laboratory


Derrick Holliday

Company: Newcastle University


Andy Bonner

Company: Pike-Square Ltd


Ronald WONG

Company: Pragmatic Semiconductor Limited


Andy Berry

Company: Qualcomm Technologies International, Ltd.

Email: aberry@qti.qualcomm.com

Website: http://www.qualcomm.com


Pete Green

Company: RAM Innovations Ltd

Profile: RAM Innovations, UK is a bespoke and flexible service provider to the electronics and semiconductor industries. RAM's R&D division has extensive expertise in embedded die packaging (EDP) using PCB manufacturing techniques, collaborating with partners at the leading edge of power electronics and semiconductor development, designing and manufacturing products that use the latest Compound Semiconductor devices. Our manufacturing services are uniquely positioned to provide low R&D services and larger volume manufacturing of EDP & Heterogeneous, 3D, 2.5D next generation high efficiency power module packaging.

Telephone: 01244532158

Email: inf@ram-innovations.com

Website: http://www.ram-innovations.com


Mia Schröder

Company: RoodMicrotec GmbH - MT19-05


John Lipp

Company: UKRI - Science and Technology Facilities Council

Profile: STFC Interconnect provides assembly, wire-bonding and fine-pitch flip-chip bonding in support of STFC's science programmes. Our advanced interconnect development programme gains access to next generation interconnect technologies in readiness for when our science programmes require them.

Telephone: +44 1235 445316

Website: http://www.stfc.ac.uk


Jeff Kettle

Company: University of Glasgow


Peter Gammon

Company: University of Warwick

Profile: The Electrical Power Research Group at Warwick University is set up to conduct internationally leading research and drive for cutting edge technology development in tackling the great challenges in power generation, energy conversion, distribution, transmission and efficient use of energy. Our research is supported by state-of-the-art research facilities in three research laboratories: Power Electronics, Applications and Technology in Energy Research (PEATER) Laboratory, Power and Control Systems Research laboratory and Power Electronics Applications Lab. The group’s expertise covers power electronic devices (SiC, fabrications, packaging, reliability, modelling and simulation), power electronics applications, drives and control, power system modelling and control, compressed air energy storage, wind power generation, HVDC, hardware-in-the-loop modelling, simulation and control.

Telephone: +44 (0)24 765 23154

Email: p.m.gammon@warwick.ac.uk

Website: http://www.warwick.ac.uk/fac/sci/eng/research/grouplist/electricalpower/


Simon Payne

Company: XJTAG

Profile: XJTAG offers a complete solution for testing electronics using JTAG Boundary Scan, providing products and services for fault detection and fast in-system programming. The integration of Ball Grid Array (BGA) packages into circuit board designs has become a standard due to their efficiency and compactness. However, the inherent challenge of testing the connectivity of these high density components with inaccessible solder balls cannot be overlooked. This is where the implementation of JTAG boundary scan becomes indispensable, and when combined with XJTAG’s products provides an powerful diagnostic tool for testing printed circuit board assemblies. XJTAG is the only boundary scan provider that designs and manufactures in the UK. The company provides an extensive range of JTAG boundary-scan hardware and software tools that use the IEEE 1149.x standards. XJTAG makes the testing of circuits quick and easy including both JTAG and non-JTAG devices. If your devices and circuits are designed with JTAG boundary scan in mind, XJTAG can offer you exceptional test coverage and accuracy, plus additional features including programming FPGAs and CPLDs. XJTAG focuses on innovative product development and high-quality technical support.

Telephone: +44 (0)1223 223 007

Email: info@xjtag.com

Website: https://www.xjtag.com


Stephanie Coombs

Company: Zuken UK Ltd

Profile: As the industry moves to complex 3D stacked structures and embedded devices, there is a need for tools that can accurately render and provide meaningful visual and DRC feedback to enable rapid right-the-first-time designs. Zuken is a global provider of leading-edge software and consulting services for electrical and electronic engineering and design for manufacture. Our electronic design automation solutions enable engineers to lay out their designs in the context of a complete system or product, featuring: • 3D multi-board PCB design • Advanced IC packaging • System level circuit engineering Both electronic (CR-8000) and electrical (E3.series) product lines are complemented by open library and design data configuration and change management platforms that provide a solid foundation for a true interdisciplinary electro-mechanical PLM data model.

Telephone: 44 1454 207804

Email: stephanie.coombs@gb.zuken.com

Website: http://www.zuken.com