Viewing All Profiles (Showing 1-25 of 29 Results)
Company: Accelonix Ltd
Profile: Accelonix supplies equipment, support and consumables to the electronics and precision machining markets. We provide local specialist skills and knowhow across our four Business Groups; Microelectronics, Metrology, Test & Device Programming and Software Solutions. Benefiting from our own UK applications, demonstration and training centre, we are able to offer our customers access to a wonderful range of state of the art equipment.
Telephone: 01223 659965
Profile: Airbus is a global leader in aeronautics, space and related services. In 2016, it generated revenues of € 67 billion and employed a workforce of around 134,000. Airbus offers the most comprehensive range of passenger airliners. Airbus is also a European leader providing tanker, combat, transport and mission aircraft, as well as Europe’s number one space enterprise and the world’s second largest space business. In helicopters, provides the most efficient civil and military rotorcraft solutions.
Company: Alter Technology UK
Profile: Alter UK is a technology-oriented company active in the field of optoelectronics & microelectronics package design and assembly services with a focus on turn-key packaging services that enable its customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments. Alter UK offers full design and assembly of custom Photonic products and is experienced in harsh environment applications, including the Space sector. Alter UK also launched
Telephone: 01506 403550
Company: Carl Zeiss Ltd
Profile: ZEISS is an internationally leading technology company operating in the fields of optics and optoelectronics. ZEISS has the most comprehensive portfolio of light, X-ray, electron and ion beam microscope systems in the industry and is a leading solution provider to the global semiconductor community. Solutions span semiconductor manufacturing from wafer fab through packaging and assembly. ZEISS materials characterisation and non-destructive failure analysis solutions deliver actionable information to both wafer fab and packaging/assembly processes to meet the semiconductor industry’s challenges for next-generation devices. With a portfolio aligned with future growth in the electronics and semiconductor industry, ZEISS is shaping the future of technology and constantly advancing the world of optics and related fields with its solutions. The company's significant, sustainable investments in research and development lay the foundation for the success and continued expansion of ZEISS' technology and market leadership. ZEISS is active globally in almost 50 countries with around 30 production sites, 60 sales and service companies and 27 R&D facilities. Founded in 1846 in Jena, the company is headquartered in Oberkochen, Germany. The Carl Zeiss Foundation, one of the largest foundations in Germany committed to the promotion of science, is the sole owner of the holding company, Carl Zeiss AG.
Telephone: 44 (0) 1223 401 500
Company: Custom Interconnect Ltd
Profile: Custom Interconnect Limited has one of the largest Chip & Wire facilities within the UK. Housed within two Clean Rooms, CIL's Micro-Electronics facility has an established reputation over 30 years of providing outstanding engineering solutions for its customers. A total of 3 Automatic Die attach machines, using conductive / non-conductive epoxies and Silver Sinter methodologies. Complimenting the die attach are 6 Automatic wire bonders using Gold ball, Aluminium wedge and Gold Wedge with various wire diameters. Areas of expertise are Medical “lab on a chip” packaging, Large area sensors, LED’s, Lasers, ASIC’s, MEMS, SiC, GaN and high power Automotive modules. In addition to the Chip & Wire facilities, CIL has 6 complete SMT lines using both RoHS and non-RoHS solder technologies, 2 x Koh Young 3D AOI, 3 x TAKAYA Flying probe testers, DAGE Quadra5 X-Ray/CT Scan, Auto & Manual BGA/CSP underfill, Selective soldering and Laser Depanelling. Our customers range from Oil & Gas downhole drill bit electronics, Medical, Defence, Aerospace, Automotive, Transportation and various Industrial applications with a full “Box Build” facility for complete product build. Quality accredited to ISO9001, ISO13485 (Medical), AS9100 (Aerospace) and Cyber Essentials, CIL is able to assemble from die through to complete product.
Telephone: 01264 321321
Company: Dynex Semiconductors Ltd
Profile: Dynex Semiconductor Ltd has a rich history in the design, development and production of low and high power IGBT modules, Bipolar capsule devices and power assemblies. Throughout the years, Dynex products have been applied in projects that vary from transportation, power grid, renewables, industrial, equipment and specialist applications for customers in Europe, US and the rapidly growing Far Eastern markets. From initial concept and design to production, Dynex can support customer requirements to provide enhanced, reliable device outlines customised for individual application requirements, including those in the electric vehicle, power grid, renewable energy, traction and industrial markets. Dynex products can be designed to industry standard or refined with the option of bespoke connectivity and/or circuit topology and/or heatsinks-water cooled/air-cooled/ phase change or double side. To ensure consistency of product performance and quality, manufacturing is carried out under strictly controlled clean room conditions.
Telephone: 01522 500 500
Company: Filtronic Broadband Limited
Profile: Filtronic designs and manufactures products that transmit, receive, condition and manage radio waves, particularly at microwave and mmWave. Its components and integrated systems are used in mission-critical communications networks worldwide. Their knowledge and ingenuity enable solutions for highly complex RF challenges. These can be applied in a range of markets, including mobile telecommunications infrastructure, defence and aerospace, and emergency first-responder communications.
Telephone: 01740 618 821
Company: Gen3 Systems
Profile: Gen3, a specialist manufacturer of award-winning test and measurement equipment used to improve electronic circuit reliability. We manufacture equipment for high voltage insulation resistance measurements, such as SIR and CAF. The equipment multiplexes across 256 channels every minute, can measure to 1012Ω, and measure up to 1250V. Gen3 designs and manufactures conformal coating process equipment - bench-top and in-line systems - and offers a range of test services. Gen3 also distributes equipment manufactured by some of the World’s leading specialists; MEK Europe, Nordson SELECT, Finetech and MBTech. Product Profile: Conformal Coatings, Electronic Production, Measuring Services/Inspection, Process Control, Quality Control, Reliability/Failure Analysis, Testing Services, Consultancy
Company: Honeystone Ltd.
Profile: Production Equipment Sales and Service for Thick Film and Packaging. Exclusive representative of Aurel Automation (screen printers, laser trimmers, multifunction dispenser and microassembly platforms, IR and convection ovens and automation solutions) and Sikama Inc. (compact conduction-convection ovens for wafer bumping, soldering etc.) in the UK. Provider of Turn-Key Solutions for Thick Film Photoimageable Fine Line Technology.
Telephone: +44 (0) 20 7357 7376
Company: Industrial production processes (Ipp)
Profile: With over 40 years’ experience, IPP (formerly APP Ltd in the UK and IPT Ltd trading as IPP in Ireland) is a technical distributor of manufacturing equipment to the electronics, pharmaceutical and medical device sectors across the UK and Ireland.
Company: Inseto (UK) Ltd
Profile: Inseto provides manufacturing equipment, plus assembly materials and adhesives for microelectronic research & production. Products include: vacuum reflow systems, plasma cleaners/etchers, probers, dicing & scribing systems, die sort and bonders, wire bonders, pull/shear test equipment, in addition to complementary machine consumables and materials.
Company: Loughborough Surface Analysis Ltd
Profile: Loughborough Surface Analysis Ltd is a long established laboratory specialising in surface analysis. The company provides specialist contract surface analysis services to both industry and academic sectors. The techniques we provide include: Secondary Ion Mass Spectrometry (SIMS), Scanning Electron Microscopy with Energy Dispersive X-Ray detection (SEM-EDX), Auger Electron Spectroscopy (AES), X-Ray Photoelectron Spectroscopy (XPS) and Focussed Ion Beam Sectioning (FIB). These techniques can be used to investigate many electronic packaging issues.
Telephone: 44 (0) 1509 260 779
Company: Loughborough University
Profile: The Electronics Manufacturing Research Group at Loughborough University addresses the challenges in the design, integration, materials and manufacture of electronics intensive products, applicable across multiple industrial sectors including telecom, transport, energy, healthcare/bio-medical, IoTs/wearable electronics and space/aerospace. Aligned closely with potential industrial applications concerning the development of novel Advanced Interconnect Materials (AIMs), the group conducts the underpinning research into 3D heterogeneous embodiment, integration and miniaturisation of future generation complex multifunctional devices. In order to fulfil the material microstructural stability and functional robustness, a wide range of manufacturing routes are being developed, including; novel soldering, sintering or bonding with micro- and nano-particles, pastes and preformed thin films, electrochemical process, selective, additive and subtractive processes.
Telephone: 44 (0) 1509 227 681
Company: Materion Corporation
Profile: Materion Advanced Materials is an industry leader in providing durable and best-cost solutions for ceramic packages and hermetic covers/lids including Visi-LidTM covers. We also offer braze and solder alloys for the microelectronics industry. Our comprehensive portfolio of packaging materials is available in precious or non-precious material, and we can customize innovative electronic package materials to satisfy your unique needs. Our high-reliability packaging also supports most configurations, applications and volume requirements. Because of our industry expertise, extensive global manufacturing capabilities and R&D proficiency, we are able to meet customers’ packaging requirements today and partner with them to meet future challenges.
Telephone: 44 (0)7887755504
Company: MCS Ltd
Company: MTC Limited
Company: Murata Power Solutions
Company: Nordson Dage
Company: Pyramid Engineering Services Limited
Profile: Pyramid Engineering Services are positioned as a market leader within the Global Semiconductor Industry for the design and manufacture of Gloveboxes, Ovens, Welding Systems and Ancillary Equipment for controlled atmosphere package encapsulation. We offer bespoke system solutions to meet customer specifications and are able to design to all levels of automation. We offer a range of Package Sealing Systems including Laser, Projection, Resistance and Cold Welding within controlled environment enclosures for customers requiring manual or automatic assembly.
Telephone: 0208 3209590
Company: Qualcomm Technologies International, Ltd.
Company: SCHOTT Primoceler
Profile: SCHOTT Primoceler addresses challenges in hermetic device manufacturing. We help our customers develop, manufacture and test hermetically sealed products. SCHOTT Primoceler offers wafer scale and chip scale bonding to create reliable, fully hermetic glass packages without heat or added materials. Our experience covers for example medical device industry, aerospace and consumer devices.
Telephone: +358 40 505 7623
Company: SPTS Technologies Ltd
Profile: SPTS Technologies is a leading supplier of etch and deposition process solutions and equipment for the global semiconductor and microelectronic device manufacturing industries. We provide advanced wafer processing solutions to the world's leading semiconductor device manufacturers and research institutions, and our end-market applications include Advanced Packaging, MEMS, high speed RF IC, photonics and power semiconductor device manufacturing.
Telephone: 01633 414000
Company: Swansea University
Company: UKRI - Science and Technology Facilities Council
Profile: STFC Interconnect provides assembly, wire-bonding and fine-pitch flip-chip bonding in support of STFC's science programmes. Our advanced interconnect development programme gains access to next generation interconnect technologies in readiness for when our science programmes require them.
Telephone: +44 1235 445316