Member Directory
Viewing All Profiles (Showing 1-25 of 35 Results)
Company: Accelonix Ltd
Profile: Accelonix supplies equipment, support and consumables to the electronics and precision machining markets. We provide local specialist skills and knowhow across our four Business Groups; Microelectronics, Metrology, Test & Device Programming and Software Solutions. Benefiting from our own UK applications, demonstration and training centre, we are able to offer our customers access to a wonderful range of state of the art equipment.
Telephone: 01223 659965
Email: sales@accelonix.co.uk
Website: http://www.accelonix.co.uk
Company: Airbus
Profile: Airbus is a global leader in aeronautics, space and related services. In 2016, it generated revenues of € 67 billion and employed a workforce of around 134,000. Airbus offers the most comprehensive range of passenger airliners. Airbus is also a European leader providing tanker, combat, transport and mission aircraft, as well as Europe’s number one space enterprise and the world’s second largest space business. In helicopters, provides the most efficient civil and military rotorcraft solutions.
Telephone: +442392704611
Email: ralph.green@airbus.com
Website: https://airbusdefenceandspace.com/
Company: Alter Technology UK
Profile: Alter UK is a technology-oriented company active in the field of optoelectronics & microelectronics package design and assembly services with a focus on turn-key packaging services that enable its customers to reduce development and manufacturing costs, accelerate time to market and reduce risk with new product developments. Alter UK offers full design and assembly of custom Photonic products and is experienced in harsh environment applications, including the Space sector. Alter UK also launched
Telephone: 01506 403550
Company: API Microelectronics Ltd
Profile: APITech combines engineering expertise and manufacturing excellence to enable mission-critical solutions. The Great Yarmouth location is an AS9100 and MIL-PRF-38534 (Classes H and K) certified, leading provider of custom high-reliability solutions for the defence, space, aerospace, industrial and energy sectors. With over 50 years’ proven heritage in these industries, APITech Great Yarmouth specialises in optoelectronics and high-temperature electronic components, modules and hybrids; critical to high performance applications in harsh environments that require the smallest possible footprint
Telephone: +44 (0) 1493 743100
Email: John.Evans@apitech.com
Website: http://www.apitech.com
Company: CSA Catapult
Profile: The Compound Semiconductor Applications Catapult is a Not for Profit organisation. It is focused on accelerating the adoption of compound semiconductors and on bringing applications to life in three technology areas: Power Electronics, RF & Microwave and Photonics. The Compound Semiconductor Applications Catapult exists to help the UK economy grow and works across the UK within a range of industry sectors from automotive to medical, and from digital communications to aerospace.
Telephone: +44 (0) 1633 373 192
Email: collaboration@csa.catapult.org.uk
Website: http://www.csa.catapult.org.uk
Company: Cupio Ltd
Profile: Cupio supplies and supports inspection from the Nordson Test and Inspection Group which includes systems for X-Ray of solder die attach both in-line and stand alone and optical systems for the measurement of die bonds, bone attach underfil and contamination. Cupio also provides failure analysis and inspection services at our facility in Basingstoke.
Telephone: 01256262800
Email: info@cupio.co.uk
Website: http://www.cupio.co.uk
Company: Custom Interconnect Ltd
Profile: Custom Interconnect Limited has one of the largest Chip & Wire facilities within the UK. Housed within two Clean Rooms, CIL's Micro-Electronics facility has an established reputation over 30 years of providing outstanding engineering solutions for its customers. A total of 3 Automatic Die attach machines, using conductive / non-conductive epoxies and Silver Sinter methodologies. Complimenting the die attach are 6 Automatic wire bonders using Gold ball, Aluminium wedge and Gold Wedge with various wire diameters. Areas of expertise are Medical “lab on a chip” packaging, Large area sensors, LED’s, Lasers, ASIC’s, MEMS, SiC, GaN and high power Automotive modules. In addition to the Chip & Wire facilities, CIL has 6 complete SMT lines using both RoHS and non-RoHS solder technologies, 2 x Koh Young 3D AOI, 3 x TAKAYA Flying probe testers, DAGE Quadra5 X-Ray/CT Scan, Auto & Manual BGA/CSP underfill, Selective soldering and Laser Depanelling. Our customers range from Oil & Gas downhole drill bit electronics, Medical, Defence, Aerospace, Automotive, Transportation and various Industrial applications with a full “Box Build” facility for complete product build. Quality accredited to ISO9001, ISO13485 (Medical), AS9100 (Aerospace) and Cyber Essentials, CIL is able to assemble from die through to complete product.
Telephone: 01264 321321
Email: john.boston@cil-uk.co.uk
Website: http://www.cil-uk.co.uk
Company: Gen3
Profile: Gen3. Testing and measuring the electronics industry for over 40 years. For three generations, we have designed, engineered, manufactured, and distributed our test and measurement equipment into the electronics industry to shield your circuits from failure in the field. Our reputation for excellence has grown to a global scale. Our team is made up of industry experts who work to set the standards around circuit testing, measurement, and compliance. We collaborate with key industry associations, offering our unique experience and expertise to educate all on what it takes to succeed. For product protection the preferred way is Gen 3, where precision comes as standard, acting as a mentor and your front-line defender. In the high-reliability arena, there is too much at stake to allow room for error. Testing must be finite and flawless. At Gen3, we understand your need for precision. Get closer to perfection by minimising your risk. Gen3. Precision as standard.
Telephone: +44 (0)1252 521500
Email: sales@gen3systems.com
Website: http://www.gen3systems.com
Company: Heraeus Electronics
Profile: Heraeus Electronics – a Global Business Unit of the Heraeus Group – is a leading supplier of material solutions for the Electronics Packaging and Component Industry in Power Electronics, Advanced Semiconductor Packaging and Automotive Electronics. Core competences include bonding wires, assembly materials, thick film pastes, substrates, and their integration into perfectly matched systems.
Telephone: +44(0)7831 315456
Email: robert.fox@heraeus.com
Website: http://www.heraeus-electronics.com
Company: Honeystone Ltd.
Profile: Production Equipment Sales and Service for Thick Film and Packaging. Exclusive representative of Aurel Automation (screen printers, laser trimmers, multifunction dispenser and microassembly platforms, IR and convection ovens and automation solutions) and Sikama Inc. (compact conduction-convection ovens for wafer bumping, soldering etc.) in the UK. Provider of Turn-Key Solutions for Thick Film Photoimageable Fine Line Technology.
Telephone: +44 (0) 20 7357 7376
Email: sergeiv@honeystone-tec.co.uk
Website: honeystone-tec.co.uk
Company: ILS2, CNH SWANSEA UNIVERSITY
Company: Imperial College London
Company: Inseto
Profile: Inseto is a leading technical distributor of equipment and related materials to the microelectronic & advanced technology sectors, as well as adhesives for electronics, automotive & industrial manufacturing.
Telephone: 01264 334505
Email: enquiries@inseto.co.uk
Website: https://www.inseto.co.uk
Company: IPP
Profile: Industrial Production Processes (IPP) Ltd, formerly APP Ltd, is a technical distributor of manufacturing equipment to the Electronics Industry in the UK and Ireland for over 40 years. Our Electronics Division delivers a range of automated assembly equipment and consumables.
Telephone: 01527 578972
Email: grutter@ippgroupltd.com
Company: Leonardo MW
Company: Loughborough Surface Analysis Ltd
Profile: Loughborough Surface Analysis Ltd is a long established laboratory specialising in surface analysis. The company provides specialist contract surface analysis services to both industry and academic sectors. The techniques we provide include: Secondary Ion Mass Spectrometry (SIMS), Scanning Electron Microscopy with Energy Dispersive X-Ray detection (SEM-EDX), Auger Electron Spectroscopy (AES), X-Ray Photoelectron Spectroscopy (XPS) and Focussed Ion Beam Sectioning (FIB). These techniques can be used to investigate many electronic packaging issues.
Telephone: 44 (0) 1509 260 779
Email: m.petty@LSALtd.co.uk
Website: http://www.LSALtd.co.uk
Company: Loughborough University
Profile: The Electronics Manufacturing Research Group at Loughborough University addresses the challenges in the design, integration, materials and manufacture of electronics intensive products, applicable across multiple industrial sectors including telecom, transport, energy, healthcare/bio-medical, IoTs/wearable electronics and space/aerospace. Aligned closely with potential industrial applications concerning the development of novel Advanced Interconnect Materials (AIMs), the group conducts the underpinning research into 3D heterogeneous embodiment, integration and miniaturisation of future generation complex multifunctional devices. In order to fulfil the material microstructural stability and functional robustness, a wide range of manufacturing routes are being developed, including; novel soldering, sintering or bonding with micro- and nano-particles, pastes and preformed thin films, electrochemical process, selective, additive and subtractive processes.
Telephone: 44 (0) 1509 227 681
Email: C.Liu@lboro.ac.uk
Website: https://www.lboro.ac.uk/departments/meme/research/research-groups/electronics-manufacturing-group/
Company: Material Consultancy Services Ltd
Telephone: 0131 440 9090
Email: suzanne@materials-consult.co.uk
Website: http://www.themcsgroup.co.uk
Company: Materion Corporation
Profile: Materion Advanced Materials is an industry leader in providing durable and best-cost solutions for ceramic packages and hermetic covers/lids including Visi-LidTM covers. We also offer braze and solder alloys for the microelectronics industry. Our comprehensive portfolio of packaging materials is available in precious or non-precious material, and we can customize innovative electronic package materials to satisfy your unique needs. Our high-reliability packaging also supports most configurations, applications and volume requirements. Because of our industry expertise, extensive global manufacturing capabilities and R&D proficiency, we are able to meet customers’ packaging requirements today and partner with them to meet future challenges.
Telephone: 44 (0)1488 686056
Company: Micross Components
Profile: Micross is a global provider of semiconductor die/wafer processing, package assembly, test and development solutions for defence, space/aerospace and demanding or harsh environments.
Telephone: 441603788967
Website: http://www.micross.com
Company: MSC Software
Profile: MSC Software: At Hexagon we are dedicated to bringing the virtual and physical worlds together to enable our customers to drive their ideas forward and stay ahead. Nowhere is this more important than in the design and manufacture of industrial and consumer electronics. Come and talk to us about: • Your electronic thermal, thermo-structural & fatigue performance challenges • Our micro scale scanning and computed tomography capabilities • Material behaviour modelling solutions • Materials, simulation and sustainability management tools • Your problems!
Telephone: T: +44(0) 1276 905041
Website: http://www.mscsoftware.com
Company: Murata Power Solutions
Company: Nordson DAGE
Profile: Dage was founded in 1961 and is a market leader in its chosen markets of Semiconductor and PCBA Manufacture. It has an award winning portfolio of Bondtester and X-ray Inspection Systems for destructive and non-destructive mechanical testing and inspection of electronic components.
Telephone: +44 1296 317828
Email: conor.mccarthy@nordson.com
Company: Oxford University
Company: Pyramid Engineering Services Limited
Profile: Pyramid Engineering Services are positioned as a market leader within the Global Semiconductor Industry for the design and manufacture of Gloveboxes, Ovens, Welding Systems and Ancillary Equipment for controlled atmosphere package encapsulation. We offer bespoke system solutions to meet customer specifications and are able to design to all levels of automation. We offer a range of Package Sealing Systems including Laser, Projection, Resistance and Cold Welding within controlled environment enclosures for customers requiring manual or automatic assembly.
Telephone: 0208 3209590
Email: stephen.pitman@pyramideng.com
Website: http://www.pyramideng.com
