Viewing All Profiles (Showing 1-25 of 28 Results)
Company: Accelonix Ltd
Profile: Accelonix supplies equipment, support and consumables to the electronics and precision machining markets. We provide local specialist skills and knowhow across our four Business Groups; Microelectronics, Metrology, Test & Device Programming and Software Solutions. Benefiting from our own UK applications, demonstration and training centre, we are able to offer our customers access to a wonderful range of state of the art equipment.
Telephone: 01223 659965
Profile: Airbus is a global leader in aeronautics, space and related services. In 2016, it generated revenues of € 67 billion and employed a workforce of around 134,000. Airbus offers the most comprehensive range of passenger airliners. Airbus is also a European leader providing tanker, combat, transport and mission aircraft, as well as Europe’s number one space enterprise and the world’s second largest space business. In helicopters, provides the most efficient civil and military rotorcraft solutions.
Company: Cupio Ltd
Profile: Cupio supplies and supports inspection from the Nordson Test and Inspection Group which includes systems for X-Ray of solder die attach both in-line and stand alone and optical systems for the measurement of die bonds, bone attach underfil and contamination. Cupio also provides failure analysis and inspection services at our facility in Basingstoke.
Company: Custom Interconnect Ltd
Profile: Custom Interconnect Limited has one of the largest Chip & Wire facilities within the UK. Housed within two Clean Rooms, CIL's Micro-Electronics facility has an established reputation over 30 years of providing outstanding engineering solutions for its customers. A total of 3 Automatic Die attach machines, using conductive / non-conductive epoxies and Silver Sinter methodologies. Complimenting the die attach are 6 Automatic wire bonders using Gold ball, Aluminium wedge and Gold Wedge with various wire diameters. Areas of expertise are Medical “lab on a chip” packaging, Large area sensors, LED’s, Lasers, ASIC’s, MEMS, SiC, GaN and high power Automotive modules. In addition to the Chip & Wire facilities, CIL has 6 complete SMT lines using both RoHS and non-RoHS solder technologies, 2 x Koh Young 3D AOI, 3 x TAKAYA Flying probe testers, DAGE Quadra5 X-Ray/CT Scan, Auto & Manual BGA/CSP underfill, Selective soldering and Laser Depanelling. Our customers range from Oil & Gas downhole drill bit electronics, Medical, Defence, Aerospace, Automotive, Transportation and various Industrial applications with a full “Box Build” facility for complete product build. Quality accredited to ISO9001, ISO13485 (Medical), AS9100 (Aerospace) and Cyber Essentials, CIL is able to assemble from die through to complete product.
Telephone: 01264 321321
Company: Dynex Semiconductors Ltd
Profile: Dynex Semiconductor Ltd has a rich history in the design, development and production of low and high power IGBT modules, Bipolar capsule devices and power assemblies. Throughout the years, Dynex products have been applied in projects that vary from transportation, power grid, renewables, industrial, equipment and specialist applications for customers in Europe, US and the rapidly growing Far Eastern markets. From initial concept and design to production, Dynex can support customer requirements to provide enhanced, reliable device outlines customised for individual application requirements, including those in the electric vehicle, power grid, renewable energy, traction and industrial markets. Dynex products can be designed to industry standard or refined with the option of bespoke connectivity and/or circuit topology and/or heatsinks-water cooled/air-cooled/ phase change or double side. To ensure consistency of product performance and quality, manufacturing is carried out under strictly controlled clean room conditions.
Telephone: 01522 500 500
Company: Filtronic Broadband Limited
Profile: Filtronic designs and manufactures products that transmit, receive, condition and manage radio waves, particularly at microwave and mmWave. Its components and integrated systems are used in mission-critical communications networks worldwide. Their knowledge and ingenuity enable solutions for highly complex RF challenges. These can be applied in a range of markets, including mobile telecommunications infrastructure, defence and aerospace, and emergency first-responder communications.
Telephone: 01740 618 821
Company: Heraeus Electronics
Profile: Heraeus Electronics – a Global Business Unit of the Heraeus Group – is a leading supplier of material solutions for the Electronics Packaging and Component Industry in Power Electronics, Advanced Semiconductor Packaging and Automotive Electronics. Core competences include bonding wires, assembly materials, thick film pastes, substrates, and their integration into perfectly matched systems.
Telephone: +44(0)7831 315456
Company: Honeystone Ltd.
Profile: Production Equipment Sales and Service for Thick Film and Packaging. Exclusive representative of Aurel Automation (screen printers, laser trimmers, multifunction dispenser and microassembly platforms, IR and convection ovens and automation solutions) and Sikama Inc. (compact conduction-convection ovens for wafer bumping, soldering etc.) in the UK. Provider of Turn-Key Solutions for Thick Film Photoimageable Fine Line Technology.
Telephone: +44 (0) 20 7357 7376
Company: ILS2, CNH SWANSEA UNIVERSITY
Company: Industrial production processes (Ipp)
Profile: Inseto is a leading technical distributor of equipment and related materials to the microelectronic & advanced technology sectors, as well as adhesives for electronics, automotive & industrial manufacturing.
Telephone: 01264 334505
Company: Loughborough Surface Analysis Ltd
Profile: Loughborough Surface Analysis Ltd is a long established laboratory specialising in surface analysis. The company provides specialist contract surface analysis services to both industry and academic sectors. The techniques we provide include: Secondary Ion Mass Spectrometry (SIMS), Scanning Electron Microscopy with Energy Dispersive X-Ray detection (SEM-EDX), Auger Electron Spectroscopy (AES), X-Ray Photoelectron Spectroscopy (XPS) and Focussed Ion Beam Sectioning (FIB). These techniques can be used to investigate many electronic packaging issues.
Telephone: 44 (0) 1509 260 779
Company: Loughborough University
Profile: The Electronics Manufacturing Research Group at Loughborough University addresses the challenges in the design, integration, materials and manufacture of electronics intensive products, applicable across multiple industrial sectors including telecom, transport, energy, healthcare/bio-medical, IoTs/wearable electronics and space/aerospace. Aligned closely with potential industrial applications concerning the development of novel Advanced Interconnect Materials (AIMs), the group conducts the underpinning research into 3D heterogeneous embodiment, integration and miniaturisation of future generation complex multifunctional devices. In order to fulfil the material microstructural stability and functional robustness, a wide range of manufacturing routes are being developed, including; novel soldering, sintering or bonding with micro- and nano-particles, pastes and preformed thin films, electrochemical process, selective, additive and subtractive processes.
Telephone: 44 (0) 1509 227 681
Company: Materion Corporation
Profile: Materion Advanced Materials is an industry leader in providing durable and best-cost solutions for ceramic packages and hermetic covers/lids including Visi-LidTM covers. We also offer braze and solder alloys for the microelectronics industry. Our comprehensive portfolio of packaging materials is available in precious or non-precious material, and we can customize innovative electronic package materials to satisfy your unique needs. Our high-reliability packaging also supports most configurations, applications and volume requirements. Because of our industry expertise, extensive global manufacturing capabilities and R&D proficiency, we are able to meet customers’ packaging requirements today and partner with them to meet future challenges.
Telephone: 44 (0)1488 686056
Company: Micross Components
Profile: Micross is a global provider of semiconductor die/wafer processing, package assembly, test and development solutions for defence, space/aerospace and demanding or harsh environments.
Company: MSC Software
Profile: MSC Software: At Hexagon we are dedicated to bringing the virtual and physical worlds together to enable our customers to drive their ideas forward and stay ahead. Nowhere is this more important than in the design and manufacture of industrial and consumer electronics. Come and talk to us about: • Your electronic thermal, thermo-structural & fatigue performance challenges • Our micro scale scanning and computed tomography capabilities • Material behaviour modelling solutions • Materials, simulation and sustainability management tools • Your problems!
Telephone: T: +44(0) 1276 905041
Company: Murata Power Solutions
Company: Nordson DAGE
Profile: Dage was founded in 1961 and is a market leader in its chosen markets of Semiconductor and PCBA Manufacture. It has an award winning portfolio of Bondtester and X-ray Inspection Systems for destructive and non-destructive mechanical testing and inspection of electronic components.
Telephone: +44 1296 317828
Company: Pyramid Engineering Services Limited
Profile: Pyramid Engineering Services are positioned as a market leader within the Global Semiconductor Industry for the design and manufacture of Gloveboxes, Ovens, Welding Systems and Ancillary Equipment for controlled atmosphere package encapsulation. We offer bespoke system solutions to meet customer specifications and are able to design to all levels of automation. We offer a range of Package Sealing Systems including Laser, Projection, Resistance and Cold Welding within controlled environment enclosures for customers requiring manual or automatic assembly.
Telephone: 0208 3209590
Company: Qualcomm Technologies International, Ltd.
Company: Siemens Digital Industries Software
Profile: Engineering departments today must develop smart products that integrate mechanical functions with electronics and controls, utilize new materials and manufacturing methods, and deliver new designs within ever shorter design cycles. This requires current engineering practices for product performance verification to evolve into a Digital Twin approach, which enables to follow a more predictive process for systems driven product development. Simcenter™ software uniquely combines system simulation, 3D CAE, and test to help you predict performance across all critical attributes earlier and throughout the entire product lifecycle. By combining physics-based simulations with insights gained from data analytics, Simcenter helps you optimize your design and deliver innovations faster and with greater confidence.
Telephone: 020 8487 3108
Company: SPTS Technologies Ltd
Profile: SPTS Technologies is a leading supplier of etch and deposition process solutions and equipment for the global semiconductor and microelectronic device manufacturing industries. We provide advanced wafer processing solutions to the world's leading semiconductor device manufacturers and research institutions, and our end-market applications include Advanced Packaging, MEMS, high speed RF IC, power semiconductor devices and LED manufacturing.
Telephone: 01633 414000
Company: UKRI - Science and Technology Facilities Council
Profile: STFC Interconnect provides assembly, wire-bonding and fine-pitch flip-chip bonding in support of STFC's science programmes. Our advanced interconnect development programme gains access to next generation interconnect technologies in readiness for when our science programmes require them.
Telephone: +44 1235 445316
Company: Ultra Electronics
Profile: Ultra CEMS – Microelectronics, is a dynamic organisation providing engineering and manufacturing services for both harsh and high temperature applications in high reliability, safety critical applications. Ultra, founded over 33 years ago, has an extensive toolbox of microelectronic assembly technologies with specific expertise in the Multichip Hybrid Module market (aka thin and thick film hybrids). Ultra is highly experienced in solving customers’ design and manufacturing problems. Our markets include defence, medical, space, aerospace, oil & gas and industrial. In addition, any electronics needing miniaturisation or designs needing obsolescence mitigation for extended serviceable life, we can also help both design and manufacture. Supported by accreditations such as thick film hybrid (BS9450) and aerospace and defence (AS9100-D), Ultra is well positioned to service these markets. Ultra has an experienced and flexible electronic design and process engineering team, being able to offer not only hybridisation, but also design assistance, e.g. taking existing designs using conventional packaged components and redesigning (if necessary) to use hybrid electronics. Further our sister site in Weymouth can help with conventional PCB assembly work. With experience in flip chip, resistor printing, excellent supply chain channels, full electrical and environmental testing, ISO 4 (Class 10) clean room facilities, 3D electronic designs (eg using flex PCB), Ultra can service most design and manufacturing requirements. Anything further, the rest of the Ultra Group could help support.
Telephone: +44 (0)2392 382 222