Viewing All Profiles (Showing 26-37 of 37 Results)
Company: Qualcomm Technologies International, Ltd.
Company: Queen Mary University of London
Company: SCHOTT Primoceler
Profile: SCHOTT Primoceler addresses challenges in hermetic device manufacturing. We help our customers develop, manufacture and test hermetically sealed products. SCHOTT Primoceler offers wafer scale and chip scale bonding to create reliable, fully hermetic glass packages without heat or added materials. Our experience covers for example medical device industry, aerospace and consumer devices.
Telephone: +358 40 505 7623
Company: Siemens Digital Industries Software
Profile: Engineering departments today must develop smart products that integrate mechanical functions with electronics and controls, utilize new materials and manufacturing methods, and deliver new designs within ever shorter design cycles. This requires current engineering practices for product performance verification to evolve into a Digital Twin approach, which enables to follow a more predictive process for systems driven product development. Simcenter™ software uniquely combines system simulation, 3D CAE, and test to help you predict performance across all critical attributes earlier and throughout the entire product lifecycle. By combining physics-based simulations with insights gained from data analytics, Simcenter helps you optimize your design and deliver innovations faster and with greater confidence.
Telephone: 020 8487 3108
Company: SPTS Technologies Ltd
Profile: SPTS Technologies is a leading supplier of etch and deposition process solutions and equipment for the global semiconductor and microelectronic device manufacturing industries. We provide advanced wafer processing solutions to the world's leading semiconductor device manufacturers and research institutions, and our end-market applications include Advanced Packaging, MEMS, high speed RF IC, photonics and power semiconductor device manufacturing.
Telephone: 01633 414000
Company: UKRI - Science and Technology Facilities Council
Profile: STFC Interconnect provides assembly, wire-bonding and fine-pitch flip-chip bonding in support of STFC's science programmes. Our advanced interconnect development programme gains access to next generation interconnect technologies in readiness for when our science programmes require them.
Telephone: +44 1235 445316
Company: University of Nottingham
Company: University of Warwick
Profile: The Electrical Power Research Group at Warwick University is set up to conduct internationally leading research and drive for cutting edge technology development in tackling the great challenges in power generation, energy conversion, distribution, transmission and efficient use of energy. Our research is supported by state-of-the-art research facilities in three research laboratories: Power Electronics, Applications and Technology in Energy Research (PEATER) Laboratory, Power and Control Systems Research laboratory and Power Electronics Applications Lab. The group’s expertise covers power electronic devices (SiC, fabrications, packaging, reliability, modelling and simulation), power electronics applications, drives and control, power system modelling and control, compressed air energy storage, wind power generation, HVDC, hardware-in-the-loop modelling, simulation and control.
Telephone: +44 (0)24 765 23154
Company: University of West Bohemia
Company: Winbro Group Technologies
Profile: Winbro Group Technologies is a global leader in ultra-precise hole-drilling, cutting, ablation and milling of electronics, aerospace and medical components. Established in Leicestershire over 50 years ago, Winbro has built an enviable reputation for innovation and problem-solving, and today supports customers in 16 countries worldwide. Winbro provides turnkey solutions through the development of non-conventional machine tools and applied technologies including individual machines, multiple machines and automated machining cells. Our success is due to our unique skill in using and combining different technologies including Laser (Drilling, Cutting and Ablation), High Speed EDM (Drilling and Milling), Grinding (VIPER & Creep-feed) and ECM (Electro Chemical Machining). Winbro also offers contract machining services through our subsidiary Winbro Advanced Machining (WAM). WAM is ISO9001:2015, AS9100D and NADCAP accredited and offers customers an off-load manufacturing facility.
Telephone: 44 1530 516 023
Company: Zuken UK Ltd
Profile: As the industry moves to complex 3D stacked structures and embedded devices, there is a need for tools that can accurately render and provide meaningful visual and DRC feedback to enable rapid right-the-first-time designs. Zuken is a global provider of leading-edge software and consulting services for electrical and electronic engineering and design for manufacture. Our electronic design automation solutions enable engineers to lay out their designs in the context of a complete system or product, featuring: • 3D multi-board PCB design • Advanced IC packaging • System level circuit engineering Both electronic (CR-8000) and electrical (E3.series) product lines are complemented by open library and design data configuration and change management platforms that provide a solid foundation for a true interdisciplinary electro-mechanical PLM data model.
Telephone: 44 1454 207804