News

REWIRE has announced the next funding opportunity round for groundbreaking projects on wide band gap (WBG) and ultra-wide band gap (UWBG) power semiconductors. This call aims to support ground-breaking research and proof-of-concept projects led by early career researchers (ECRs) that advance understanding and capability in WBG/UWBG semiconductor devices and packaging.

Gain theoretical and practical understanding of the wire bonding process as a key microelectronic interconnection technique in this online training course created by Cardiff University in conjunction with IMAPS-UK

The Electronics for Extreme Environments Conference 2026 featured electronics that must endure in high and low temperature, high field strengths and severe mechanical conditions

Call for Abstracts for RF, Microwave and Photonics Packaging (RaMPoP) Conference to be held on Thursday 26th November 2026 at the Semiconductor Catapult, with a Call for Abstracts to be submitted by 28th August 2026.

The 2nd International Responsible Electronics and Circular Technologies (REACT) Conference will be held at the Technology and Innovation Centre, Glasgow on 17-18 November 2026, with a Call for Papers to be submitted by 21st June 2026.

The Cambridge Wireless Engineering and Technology Conference will examine the critical enabling technologies behind next-generation innovation, with particular emphasis on semiconductors and photonics as the foundations for future connectivity, compute capability, and emerging technology applications.

the 29th World Micromachining Summit (MMS2026), hosted this year at the University of Southampton from 14-17 June 2026. As innovations in Semiconductors, AI, and Quantum Computing accelerate, the advanced packaging and heterogeneous integration of these micro- and nanotechnologies (MNT) are more crucial than ever for real-world application.

REWIRE and its partners are seeking to better understand the barriers to increased diversity of the UK semiconductor workforce and the actions are needed to overcome them. We are inviting applications for an EDI pilot study, which will gather data and insights to uncover structural barriers and inform targeted interventions to drive a more inclusive and sustainable talent pipeline for the sector.

This workshop provides a technical overview of the current developments in Advanced Packaging and Heterogeneous Integration in the UK.

The IMAPS-UK organised MicroTech 2026 Conference on Driving Innovation in Semiconductor Packaging explored the themes of advanced packaging and heterogeneous integration.