IMAPS-UK Webinar Design for Manufacturing Click on the above heading to download and view the video of the Design for Manufacturing Webinar held on 11th March 2020. It lasts approximately 1 hour 15 minutes. If you just require a copy of the slides, you can download here: IMAPS UK Webinar Design for Manufacturing
Due to the exceptional circumstances we find ourselves in as a result of the global Covid-19 pandemic, we have decided to postpone the MicroTech Conference from 19th March 2020 to 16th September 2020 * for this year only, still to be held at RAL, Harwell Campus (* provisional date – subject to confirmation). All details […]
The Compound Semiconductor Applications (CSA) Catapult is organising an intensive two day Professional Development course on “Advanced Packaging Technologies and Methodologies for Compound Semiconductors” on 24th and 25th March 2020 at their facility in Newport, South Wales. The course, run by Andy Longford, will cover the details of electronic packaging requirements for RF, Photonics and […]
This IMAPS-UK organised RelQual 2020: Quality and Reliability for Electronic Assembly Workshop and sponsored by Nordson Dage was held at TWI, Abington, Cambridge on 6 February 2020 explored many aspects of New Product Introduction and the challenges faced by the micro-electronics industry in satisfying more demanding customer needs. Download a copy of the event report […]
IMAPS-UK Webinar Micro-Electronics Packaging for Harsh Environments Click on the above heading to download and view the video of the Micro-Electronics Packaging for Harsh Environments Webinar held on 20th January 2020. It lasts approximately 1 hour 20 minutes. If you just require a copy of the slides, you can download here: IMAPS UK Micro-Electronics […]
This IMAPS-UK organised Micro-Electronics Packaging for Harsh Environments Conference held at the Satellite Applications Catapult in Harwell on 28 November 2019 provided guidance for designers and engineers to select suitable electronic packaging materials and processes for extreme environment applications. Download a copy of the event report HERE.
The theme of MicroTech 2019 was “Power in Packaging”, reviewing the materials, processes and equipment required to manufacture “state of the art” power modules for the transportation and energy industries. Download a copy of the event report here ..
The Interconnect of Things (IoT) workshop was held at the CPI Darlington Facility on 7 February 2019, supported by the CPI Newton Aycliffe. A brief event report is now available …. It can also be downloaded here … or from the website area – Free downloads
Role:Product Design Engineers – Packaging and/or Optics IMAPS-UK corporate member,API Technologies is looking to recruit a number of Product Design Engineers in Packaging and Optics They are looking for a talented Product Design Engineer to join their Engineering Team where you will provide technical design and layout expertise for both customer and internal released and […]
Role:Sales Manager – Semiconductor Equipment & Materials IMAPS-UK corporate member, Inseto is looking to recruit a specialist full time Sales Manager to develop and grow the Company’s Semiconductor manufacturing equipment and material sales throughout the UK, Ireland and Nordic regions. The products include wafers, mask aligners, coaters, developers, wafer bonders, metrology systems, plasma systems, probe […]