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Call for Abstracts for MicroTech 2022 on 30 March 2022

IMAPS-UK is pleased to announce a Call for Abstracts for the Annual MicroTech 2022 Conference with the theme of Next Generation of Electronics and People. The MicroTech 2022 Conference is planned to be held at the Rutherford Appleton Laboratories (RAL), Harwell Campus on Wednesday 30 March 2022. Abstracts are invited on the following topics: Markets […]

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Call for Abstracts for Centre for Power Electronics Annual Conference 5-6 July 2022

IMAPS-UK and the Centre for Power Electronics (CPE) are pleased to announce a Call for Abstracts for the Annual CPE Conference from Early and Mid Career Academics. The CPE Conference is planned to be held at the University of Warwick on 5-6 July 2022. Abstracts are invited from early/mid career academics which describe the latest […]

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IMAPS-UK announce Call for Abstracts for IPower3 – Electronic Packaging for Net Zero

IMAPS-UK are pleased to announce a Call for Abstracts for iPower3 on the theme of Electronic Packaging for Net Zero. IPower3 will be held at the University of Warwick on Thursday 2 December 2021. IMAPS-UK invites Abstracts which describe the latest advances in electronic package design, materials, processes, next-level-integration and performance while maintaining reliability, sustainability, […]

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Centre for Power Electronics Annual Conference Report

The Centre for Power Electronics (CPE) and IMAPS-UK organised the Annual CPE Conference on 13 – 15 July 2021 The Conference featured state of the art presentations from academic and industrial speakers, oral and poster presentations from Early Career Researchers, exhibitor videos and panel sessions on the status of adoption of wide bandgap devices and […]

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Free Seminar on Additive Manufactured Electronics – 18 May 2021

The AME Academy is running a seminar on Additive Manufacturing of Electronics with leading industry experts, including IDTechEx, Fraunhofer IPA, University of Texas, Devcom ARL and Nano-Dimension on Tuesday 18 May 2021 from 10:00 to 14:00 US Eastern Standard Time (15:00 to 19:00 UK Time). This online event will cover the future of additive manufacturing, […]

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Designing the Future of Additive Manufactured Electronics – Online Workshop Report

The EPSRC supported Design for Additive Manufacturing Network and IMAPS-UK organised Designing the Future of Additive Manufactured Electronics Workshop held on 21st and 22nd April 2021 featured state of the art presentations and interactive sessions to identify the main challenges faced in introducing additive manufacturing within the electronics sector. Download the . Please click on […]

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IMAPS-UK MicroTech 2021 Online Conference Report

The IMAPS-UK organised MicroTech 21 Online Conference on Heterogeneous Integration explored many aspects of Heterogeneous Integration covering packaging developments for ICs, power modules and photonics, materials, processes and including wider considerations of sustainability, equality, diversity and inclusivity within the electronics industry. Download the If you need any further information, please contact office@imaps.org.uk

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Research Showcase: Recent Advances on Reliability and Gate Driving of WBG Power Electronics – 11-12 January 2021 – Downloads

The IMAPS-UK Research Showcase – Recent Advances on Reliability and Gate Driving of WBG Power Electronics addressed several of the key issues critical to the increased adoption of Wide Bandgap (WBG) Semiconductors within the growing power electronics industry. This event was supported by The Centre for Power Electronics and sponsored by Inseto Ltd. Programme Literature […]

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IMAPS-UK announce Call for Abstracts for MicroTech 2021 – Heterogeneous Integration – Packaging Future Microsystems

IMAPS-UK are pleased to announce a Call for Abstracts for MicroTech 2021 on the theme of Heterogeneous Integration – Packaging Future Microsystems. MicroTech 2021 will be held Online on Thursday 25 March 2021. The main conference topics are based on the Heterogeneous Integration Roadmap produced by the IEEE-EPS, covering the following chapters: High Performance Computing […]

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Fundamentals of Electronic Packaging Tutorial – A Survey of Failure Analysis Techniques for Packaging by Greg Johnson, Zeiss Microscopy – 23 October 2020

This Packaging Tutorial was supported by Zeiss Microscopy In order to access a copy of the Audio Version of the presentation, please subscribe to Zeiss Microscopy News. If you require a copy of the presentation, you can download here: – 21MB

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