News
National Advanced Semiconductor Packaging and Integration Centre – Market Demand Study
The National Advanced Semiconductor Packaging and Integration Centre (NASPIC) – Market Demand Study has provided details of the proposed facility and is seeking your input to guide the future direction of the capability through an online questionnaire.
IMAPS-UK Academic Conference 2026 – Report
The IMAPS-UK Academic Conference 2026 took place on Wednesday 2nd September 2026 at the University of Warwick, Coventry, UK focused on Advanced Electronics Packaging R&D in the UK.
Call for Abstracts for MicroTech 2027 – Thursday 8 April 2027
IMAPS-UK invites Abstracts to its MicroTech 2027 Conference on 8 April 2027 in Loughborough on applications, advanced packaging technologies, design, materials and manufacturing and test and reliability assessment
REWIRE: Early Career Researchers: Open Call for Proposals for Power Semiconductor Innovation
REWIRE has announced the next funding opportunity round for groundbreaking projects on wide band gap (WBG) and ultra-wide band gap (UWBG) power semiconductors. This call aims to support ground-breaking research and proof-of-concept projects led by early career researchers (ECRs) that advance understanding and capability in WBG/UWBG semiconductor devices and packaging.
Introduction to Wire Bonding – Online Course
Gain theoretical and practical understanding of the wire bonding process as a key microelectronic interconnection technique in this online training course created by Cardiff University in conjunction with IMAPS-UK
Electronics for Extreme Environments Conference 2026 Report
The Electronics for Extreme Environments Conference 2026 featured electronics that must endure in high and low temperature, high field strengths and severe mechanical conditions
Call for Abstracts for RaMPoP Conference, Newport on 26 November 2026
Call for Abstracts for RF, Microwave and Photonics Packaging (RaMPoP) Conference to be held on Thursday 26th November 2026 at the Semiconductor Catapult, with a Call for Abstracts to be submitted by 28th August 2026.
Call for Papers for REACT Conference, Glasgow on 17 -18 November 2026
The 2nd International Responsible Electronics and Circular Technologies (REACT) Conference will be held at the Technology and Innovation Centre, Glasgow on 17-18 November 2026, with a Call for Papers to be submitted by 21st June 2026.
Call for Speakers: CWTEC – Cambridge Wireless Technology and Engineering Conference
The Cambridge Wireless Engineering and Technology Conference will examine the critical enabling technologies behind next-generation innovation, with particular emphasis on semiconductors and photonics as the foundations for future connectivity, compute capability, and emerging technology applications.
World Micromachining Summit, University of Southampton – 14 -17 June 2026
the 29th World Micromachining Summit (MMS2026), hosted this year at the University of Southampton from 14-17 June 2026. As innovations in Semiconductors, AI, and Quantum Computing accelerate, the advanced packaging and heterogeneous integration of these micro- and nanotechnologies (MNT) are more crucial than ever for real-world application.
